AD8134(RevB) データシートの表示（PDF） - Analog Devices

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AD8134
(Rev.:RevB)

Triple Differential Driver With Sync-On-Common-Mode

Analog Devices 

Data Sheet

ABSOLUTE MAXIMUM RATINGS

Table 3.

Parameter

Supply Voltage

HSYNC, VSYNC, Sync Level

Power Dissipation

Input Common-Mode Voltage

Storage Temperature Range

Operating Temperature Range

Lead Temperature (Soldering 10 sec)

Junction Temperature

Rating

12 V

±VS

See Figure 3

±VS

−65°C to +125°C

−40°C to +85°C

300°C

150°C

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

θJA is specified for the worst-case conditions, that is, θJA is

specified for the device soldered in a circuit board in still air.

Table 4. Thermal Resistance with the Underside Pad

Thermally Connected to a Copper Plane

Package Type/PCB Type

θJA

Unit

24-Lead LFCSP/4-Layer

70

°C/W

Maximum Power Dissipation

The maximum safe power dissipation in the AD8134 package is

limited by the associated rise in junction temperature (TJ) on

the die. At approximately 150°C, which is the glass transition

temperature, the plastic changes its properties. Even temporarily

exceeding this temperature limit can change the stresses that the

package exerts on the die, permanently shifting the parametric

performance of the AD8134. Exceeding a junction temperature

of 175°C for an extended period can result in changes in the

silicon devices potentially causing failure.

AD8134

The power dissipated in the package (PD) is the sum of the

quiescent power dissipation and the power dissipated in the

package due to the load drive for all outputs. The quiescent

power is the voltage between the supply pins (VS) times the

quiescent current (IS). The load current consists of differential

and common-mode currents flowing to the loads, as well as

currents flowing through the internal differential and common-

mode feedback loops. The internal resistor tap used in the

common-mode feedback loop places a 4 kΩ differential load on

the output. RMS output voltages should be considered when

dealing with ac signals.

Airflow reduces θJA. In addition, more metal directly in contact

with the package leads from metal traces, through holes,

ground, and power planes reduce the θJA. The exposed pad on

the underside of the package must be soldered to a pad on the

PCB surface that is thermally connected to a PCB plane to

achieve the specified θJA.

Figure 3 shows the maximum safe power dissipation in the

package vs. the ambient temperature for the 24-lead LFCSP

(70°C/W) on a JEDEC standard 4-layer board with the

underside paddle soldered to a pad that is thermally connected

to a PCB plane. θJA values are approximations.

4.0

3.5

3.0

2.5

2.0

LFCSP

1.5

1.0

0.5

0

–40

–20

0

20

40

60

80

AMBIENT TEMPERATURE (°C)

Figure 3. Maximum Power Dissipation vs. Temperature for a 4-Layer Board

ESD CAUTION

Rev. B | Page 5 of 20

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