AD9265(RevA) データシートの表示（PDF） - Analog Devices

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AD9265
(Rev.:RevA)

16-Bit, 125 MSPS/105 MSPS/80 MSPS, 1.8 V Analog-to-Digital Converter

Analog Devices 

AD9265

ABSOLUTE MAXIMUM RATINGS

Table 6.

Parameter

Electrical

AVDD to AGND

DRVDD to AGND

SVDD to AGND

VIN+, VIN− to AGND

CLK+, CLK− to AGND

SYNC to AGND

VREF to AGND

SENSE to AGND

VCM to AGND

RBIAS to AGND

CSB to AGND

SCLK/DFS to AGND

SDIO/DCS to AGND

OEB to AGND

PDWN to AGND

LVDS to AGND

LVDS_RS to AGND

DITHER to AGND

D0 through D15 to AGND

DCO to AGND

Environmental

Operating Temperature Range

(Ambient)

Maximum Junction Temperature

Under Bias

Storage Temperature Range

(Ambient)

Rating

−0.3 V to +2.0 V

−0.3 V to +2.0V

−0.3 V to +3.6 V

−0.3 V to AVDD + 0.2 V

−0.3 V to AVDD + 0.2 V

−0.3 V to AVDD + 0.2 V

−0.3 V to AVDD + 0.2 V

−0.3 V to AVDD + 0.2 V

−0.3 V to AVDD + 0.2 V

−0.3 V to AVDD + 0.2 V

−0.3 V to SVDD +0.3 V

−0.3 V to SVDD +0.3 V

−0.3V to SVDD + 0.3 V

−0.3 V to DRVDD + 0.2 V

−0.3 V to DRVDD + 0.2 V

−0.3 V to AVDD + 0.2 V

−0.3 V to AVDD + 0.2 V

−0.3 V to AVDD + 0.2 V

−0.3 V to DRVDD + 0.2 V

−0.3 V to DRVDD + 0.2 V

−40°C to +85°C

150°C

−65°C to +150°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL CHARACTERISTICS

The exposed paddle must be soldered to the ground plane for

the LFCSP package. Soldering the exposed paddle to the customer

board increases the reliability of the solder joints and maximizes

the thermal capability of the package.

Typical θJA is specified for a 4-layer PCB with a solid ground

plane. As shown, airflow improves heat dissipation, which

reduces θJA. In addition, metal in direct contact with the package

leads from metal traces, through holes, ground, and power

planes, reduces the θJA.

Table 7. Thermal Resistance

Package Type

Airflow

Velocity

(m/s)

48-Lead LFCSP

0

(CP-48-8)

1.0

2.5

θJA1, 2

24.5

21.4

19.2

θJC1, 3

1.3

θJB1, 4

12.7

Unit

°C/W

°C/W

°C/W

1 Per JEDEC 51-7, plus JEDEC 25-5 2S2P test board.

2 Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air).

3 Per MIL-Std 883, Method 1012.1.

4 Per JEDEC JESD51-8 (still air).

ESD CAUTION

Rev. A | Page 10 of 44

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