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ADG726BCP データシートの表示(PDF) - Analog Devices

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ADG726BCP Datasheet PDF : 12 Pages
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ADG726/ADG732
ABSOLUTE MAXIMUM RATINGS1
(TA = 25°C, unless otherwise noted.)
VDD to VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
VSS to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V to –7 V
Analog Inputs2 . . . . . . . . . . . . . . VSS – 0.3 V to VDD + 0.3 V or
30 mA, Whichever Occurs First
Digital Inputs2 . . . . . . . . . . . . . . . . . . –0.3 V to VDD + 0.3 V or
30 mA, Whichever Occurs First
Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 mA
(Pulsed at 1 ms, 10% Duty Cycle Max)
Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . . 30 mA
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . . . –40°C to +85°C
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
Thermal Impedence (Four-layer board)
48-Lead LFCSP . . . . . . . . . . . . . . . . . . . . . . . . . . . 25ЊC/W
48-Lead TQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . 54.6ЊC/W
Lead Temperature, Soldering (10 sec) . . . . . . . . . . . . . 300°C
IR Reflow, Peak Temperature (<20 sec) . . . . . . . . . . . . 235°C
NOTES
1Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only and functional operation of
the device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability. Only one absolute
maximum rating may be applied at any one time.
2Overvoltages at A, EN, WR, CS, S, or D will be clamped by internal diodes.
Current should be limited to the maximum ratings given.
Model
ADG726BCP
ADG726BSU
ADG732BCP
ADG732BSU
ORDERING GUIDE
Temperature Range Package Description
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
Chip Scale Package (LPCSP)
Thin Quad Flatpack (TQFP)
Chip Scale Package (LPCSP)
Thin Quad Flatpack (TQFP)
Package Option
CP-48
SU-48
CP-48
SU-48
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the ADG726/ADG732 features proprietary ESD protection circuitry, permanent damage
may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
PIN CONFIGURATIONS
LFCSP and TQFP
S12 1
S11 2
S10 3
S9 4
S8 5
S7 6
S6 7
S5 8
S4 9
S3 10
S2 11
S1 12
NC = NO CONNECT
PIN 1
INDICATOR
ADG732
TOP VIEW
36 S28
35 S27
34 S26
33 S25
32 S24
31 S23
30 S22
29 S21
28 S20
27 S19
26 S18
25 S17
S12A 1
S11A 2
S10A 3
S9A 4
S8A 5
S7A 6
S6A 7
S5A 8
S4A 9
S3A 10
S2A 11
S1A 12
NC = NO CONNECT
PIN 1
INDICATOR
ADG726
TOP VIEW
36 S12B
35 S11B
34 S10B
33 S9B
32 S8B
31 S7B
30 S6B
29 S5B
28 S4B
27 S3B
26 S2B
25 S1B
–6–
REV. 0

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