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ADL5541-EVALZ データシートの表示(PDF) - Analog Devices

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ADL5541-EVALZ
ADI
Analog Devices ADI
ADL5541-EVALZ Datasheet PDF : 13 Pages
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Data Sheet
BASIC CONNECTIONS
The basic connections for operating the ADL5541 are shown in
Figure 20. Recommended components are listed in Table 5. The
input and output should be ac-coupled with appropriately sized
capacitors (device characterization was performed with 33 pF
capacitors). A 5 V dc bias is supplied to the amplifier via GND
(Pin 6) and through a biasing inductor connected to RFOUT
(Pin 8). The bias voltage should be decoupled using a 1 µF
capacitor, a 1.2 nF capacitor, and two 68 pF capacitors.
RFIN
VCC
C1
33pF
C3
1µF
C6
C5
C4
1µF
1.2nF
68pF
ADL5541
1 RFIN
RFOUT 8
L1
47nH
C2
33pF
2 GND
GND 7
GND
3 GND
GND 6
4 CB
VPOS 5
VCC
C7
68pF
RFOUT
Figure 20. Basic Connections
For operation below 500 MHz, a larger biasing choke and ac
coupling capacitors are necessary (see Table 5). Figure 21 shows
input return loss, output return loss, and gain for frequencies
between 200 MHz and 500 MHz. The noise figure performance
for operation from 200 MHz to 500 MHz is shown in Figure 22.
17.0
–5
16.5
16.0
–10
15.5
S21
15.0
–15
14.5
14.0
–20
13.5
S22
13.0
–25
S11
12.5
12.0
–30
200
250
300
350
400
450
500
FREQUENCY (MHz)
Figure 21. Input Return Loss (S11), Output Return Loss (S22), and
Gain (S21) vs. Frequency
ADL5541
4.5
4.0
3.5
3.0
2.5
2.0
200
250
300
350
400
450
500
FREQUENCY (MHz)
Figure 22. Noise Figure vs. Frequency from 200 MHz to 500 MHz
SOLDERING INFORMATION AND RECOMMENDED
PCB LAND PATTERN
Figure 23 shows the recommended land pattern for the ADL5541.
To minimize thermal impedance, the exposed paddle on the
package underside should be soldered down to a ground plane
along with Pin 2, Pin 3, Pin 6, and Pin 7. If multiple ground
layers exist, they should be stitched together using vias (a
minimum of five vias is recommended). For more information
on land pattern design and layout, refer to Application Note
AN-772, A Design and Manufacturing Guide for the Lead Frame
Chip Scale Package (LFCSP).
2.03mm
PIN 1
PIN 8
0.5mm
1.85mm
1.78mm
PIN 4
PIN 5
0.71mm
1.53mm
Figure 23. Recommended Land Pattern
Table 5. Recommended Components for Basic Connections
Frequency
C1
C2
C3 L1
20 MHz to 200 MHz
0.1 µF 0.1 µF 1 µF 1 µH (Coilcraft 0805LS-102XJL_ or equivalent)
200 MHz to 500 MHz 0.1 µF 0.1 µF 1 µF 470 nH (Coilcraft 0603LS-471-NX or equivalent)
500 MHz to 6000 MHz 33 pF 33 pF 1 µF 47 nH (Coilcraft 0603CS-47-NX or equivalent)
C4
C5
C6 C7
68 pF 1.2 nF 1 µF 68 pF
68 pF 1.2 nF 1 µF 68 pF
68 pF 1.2 nF 1 µF 68 pF
Rev. B | Page 11 of 13

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