ADM1032ARMZ-001 データシートの表示（PDF） - ON Semiconductor

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ADM1032ARMZ-001

±1°C Remote and Local System Temperature Monitor

ON Semiconductor 

ADM1032

ON−CHIP

TEMPERATURE

SENSOR

LOCAL TEMPERATURE

VALUE REGISTER

D+

ANALOG

A/D

D–

MUX

CONVERTER

BUSY RUN/STANDBY

REMOTE TEMPERATURE

VALUE REGISTER

REMOTE OFFSET

REGISTER

EXTERNAL DIODE OPEN−CIRCUIT

ADM1032

VDD

GND

LIMIT

COMPARATOR

STATUS REGISTER

ADDRESS POINTER

REGISTER

CONVERSION RATE

REGISTER

LOCAL TEMPERATURE

LOW LIMIT REGISTER

LOCAL TEMPERATURE

HIGH LIMIT REGISTER

REMOTE TEMPERATURE

LOW LIMIT REGISTER

REMOTE TEMPERATURE

HIGH LIMIT REGISTER

LOCAL THERM LIMIT

REGISTER

EXTERNAL THERM LIMIT

REGISTER

CONFIGURATION

REGISTER

INTERRUPT

MASKING

SMBUS INTERFACE

SDATA

SCLK

Figure 1. Functional Block Diagram

ALERT

THERM

ABSOLUTE MAXIMUM RATINGS

Parameter

Rating

Unit

Positive Supply Voltage (VDD) to GND

D+

D− to GND

−0.3, +5.5

V

−0.3 to VDD + 0.3

V

−0.3 to +0.6

V

SCLK, SDATA, ALERT

−0.3 to +5.5

V

THERM

Input Current, SDATA, THERM

−0.3 to VDD + 0.3

V

−1, +50

mA

Input Current, D−

±1

mA

ESD Rating, All Pins (Human Body Model)

>1000

V

Maximum Junction Temperature (TJ Max)

Storage Temperature Range

150

°C

−65 to +150

°C

IR Reflow Peak Temperature

220

°C

IR Reflow Peak Temperature for Pb−Free

260

°C

Lead Temperature (Soldering 10 sec)

300

°C

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

NOTE: This device is ESD sensitive. Use standard ESD precautions when handling.

THERMAL CHARACTERISTICS

8−Lead SOIC−N Package

8−Lead MSOP Package

Package Type

qJA

Unit

121

°C

142

°C

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