Preliminary Technical Data
ASSEMBLY RECOMMENDATIONS
VPD
VCC
1000pF
OUTB
560pF
200pF
OUT
Figure 3. 5-Pin TO-46 w/External Photodiode Supply VPD
• 1× VENDOR SPECIFIC (0.3mm × 0.3mm) 10.0Gbps Photo Diode
• 1× ADN2821 (0.7mm × 1.2mm) Analog Devices SiGe 10.0Gbps Trans-Impedance Amplifier
• 200pF RF Single Layer Capacitor
• 560pF RF Single Layer Capacitor
• 1000pF Ceramic Cap
Notes:
1. Minimize all GND bond wire lengths.
2. Minimize IN, FILTER, OUT and OUTB bond wire lengths.
3. Maintain symmetry in length and orientation between IN and FILTER bond wires.
4. Maintain symmetry in length and orientation between OUT and OUTB bond wires.
5. Maintain symmetry between IN/FILTER and OUT/OUTB bond wires.
Rev. PrL | Page 7 of 8
ADN2821