ADN2830 データシートの表示（PDF） - Analog Devices
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ADN2830 Datasheet PDF : 9 Pages
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PRELIMINARY TECHNICAL DATA
POWER CONSUMPTION
The ADN2830 die temperature must be kept below 125oC.
The Oja is 32oC/W when soldered in a four layer P.C.B. The
LFCSP package has an exposed paddle and as such needs to
be soldered to the P.C.B to achieve this thermal performance.
Tdie = Tambient + Oja . P
Icc = Iccmin
P = Vcc.Icc + (Ibias.Vbias_pin)
ADN2830
VCC
MPD
LD
24
VCC2
NC
G ND2
IBIAS
G ND2
G ND2
IBIAS
NC
32
1
VCC
FAIL
DEGRAD E
16
NC
NC
GND1
NC
VCC5
VCC1
PAVCAP
PAVCAP
1uF
8
VCC
100n F
10uF
GND
Place 100nF cap
close to pin 8
Figure 7. Test Circuit, stand-alone mode, IMPD input not used.
REV. PrE May 2002
–5–
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