ADN2841ACP-48(2002) データシートの表示（PDF） - Analog Devices
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ADN2841ACP-48 Datasheet PDF : 12 Pages
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Parameter
Min Typ Max
Unit
IBMON, IMMON, IMPDMON, IMPDMON2
IBMON, IMMON Division Ratio
IMPDMON, IMPDMON2
IMPDMON to IMPDMON2 Matching
Compliance Voltage
100
A/A
1
A/A
1
%
0
VCC – 1.2 V
SUPPLY
ICC5
VCC6
0.05
A
4.5 5.0 5.5
V
NOTES
1Temperature range: –40°C to +85°C.
2When the voltage on DATAP is greater than the voltage on DATAN, the modulation current flows in the IMODP pin.
3Guaranteed by design and characterization. Not production tested.
4IDTONE may cause eye distortion.
5ICC for power calculation is the typical ICC given.
6All VCCS should be shorted together.
Specifications subject to change without notice.
SETUP
tS
HOLD
tH
DATAP/DATAN
ADN2841
Conditions/Comments
IMPD = 1200 µA
IBIAS = IMOD = 0
CLKP
Figure 1. Setup and Hold Time
ABSOLUTE MAXIMUM RATINGS1
(TA = 25°C, unless otherwise noted.)
VCC to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
Operating Temperature Range
Industrial . . . . . . . . . . . . . . . . . . . . . . . . . . –40°C to +85°C
Storage Temperature Range . . . . . . . . . . –65°C to +150°C
Junction Temperature (TJ MAX) . . . . . . . . . . . . . . . . . . 150°C
48-Lead LFCSP Package
Power Dissipation . . . . . . . . . . . . . . .(TJ MAX – TA)/θJA mW
θJA Thermal Impedance2 . . . . . . . . . . . . . . . . . . . . 25°C/W
Lead Temperature (Soldering for 10 sec) . . . . . . . . 300°C
32-Lead LFCSP Package
Power Dissipation . . . . . . . . . . . . . . . (TJ MAX – TA)/θJA mW
θJA Thermal Impedance2 . . . . . . . . . . . . . . . . . . . . 32°C/W
Lead Temperature (Soldering for 10 sec) . . . . . . . . . 300°C
NOTES
1Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability. Transient currents of
up to 100 mA will not cause SCR latch-up.
2θJA is defined when the part is soldered onto a four-layer board.
Model
ADN2841ACP-32
ADN2841ACP-48
ADN2841ACP-32-RL
ADN2841ACP-32-RL7
ADN2841ACP-48-RL
ORDERING GUIDE
Temperature Range Package Description
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
32-Lead LFCSP
48-Lead LFCSP
32-Lead LFCSP
32-Lead LFCSP
48-Lead LFCSP
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the ADN2841 features proprietary ESD protection circuitry, permanent damage may occur on
devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are
recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
REV. A
–3–
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