ADN2847ACPZ-48 データシートの表示（PDF） - Analog Devices
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ADN2847ACPZ-48 Datasheet PDF : 16 Pages
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ADN2847
DIE PAD COORDINATES
2620µm
GND2
GND2
IMMON VCC3 FAIL
CLKSEL GND
IDTONE IBMON GND3 ALS DEGRADE GND
GND2
VCC2
IMODN
IMODN
GND2
IMODP
IMODP
GND2
GND2
IBIAS
IBIAS
CCBIAS
GND
CLKN
CLKP
GND1
DATAP
DATAN
GND1
VCC1
GND
PAVCAP
ERCAP
GND
ASET PSET IMPD IMPDMON2 GND4
LBWSET ERSET GND IMPDMON
IMPD2
VCC4
Figure 5. Metallization Photograph
Table 4. Die Pad Coordinates1
Pad Number
Pad Name
1
TP1 (GND)
2
LBWSET
3
ASET
4
ERSET
5
PSET
6
TP2 (GND)
7
IMPD
8
IMPDMON
9
IMPDMON2
10
IMPD2
11
GND4
12
VCC4
13
ERCAP
14
PAVCAP
15
TP3 (GND)
16
VCC1
17
GND1
18
DATAN
19
DATAP
20
GND1
21
CLKP
22
CLKN
23
TP4 (GND)
24
TP5 (GND)
x[μm]
−996
−996
−996
−996
−996
−996
−996
−996
−996
−996
−996
−995
−925
−777
−606
−389
−200
−70
83
263
442
596
762
996
1 With the origin in the center of the die (see Figure 5).
y[μm]
1026
853
679
506
332
159
−15
506
−361
−534
−724
−964
−1191
−1191
−1191
−1191
−1191
−1191
−1191
−1191
−1191
−1191
−1191
−1109
Data Sheet
2280µm
DIE ROTATED 90° IN PACKAGE
1
2620µm
Figure 6. Bonding Diagram
Pad Number
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
Pad Name
TP6 (GND)
CLKSEL
DEGRADE
FAIL
ALS
VCC3
GND3
IMMON
IBMON
GND2
IDTONE
GND2
GND2
VCC2
IMODN
IMODN
GND2
IMODP
IMODP
GND2
GND2
IBIAS
IBIAS
CCBIAS
x[μm]
996
996
996
996
996
996
996
996
996
996
995
995
867
713
500
396
242
88
−16
−239
−443
−633
−772
−912
y[μm]
−935
−762
−589
−415
−242
−19
251
441
614
804
993
1133
1191
1191
1191
1191
1191
1191
1191
1191
1191
1191
1191
1191
Rev. B | Page 6 of 16
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