ADN2850BRUZ25(RevF) データシートの表示（PDF） - Analog Devices
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ADN2850BRUZ25 Datasheet PDF : 30 Pages
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ADN2850
Data Sheet
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 3.
Parameter
VDD to GND
VSS to GND
VDD to VSS
VB, VW to GND
IB, IW
Pulsed1
Continuous
Digital Input and Output Voltage to GND
Operating Temperature Range2
Maximum Junction Temperature (TJ max)
Storage Temperature Range
Lead Temperature, Soldering
Vapor Phase (60 sec)
Infrared (15 sec)
Thermal Resistance
Junction-to-Ambient θJA,16-Lead TSSOP
Junction-to-Ambient θJA,16-Lead LFSCP
Junction-to-Case θJC, 16-Lead TSSOP
Package Power Dissipation
Rating
–0.3 V to +7 V
+0.3 V to −7 V
7V
VSS − 0.3 V to VDD + 0.3 V
±20 mA
±2 mA
−0.3 V to VDD + 0.3 V
−40°C to +85°C
150°C
−65°C to +150°C
215°C
220°C
150°C/W
35°C/W
28°C/W
(TJ max − TA)/θJA
1 Maximum terminal current is bounded by the maximum current handling of
the switches, maximum power dissipation of the package, and maximum
applied voltage across any two of the A, B, and W terminals at a given
resistance.
2 Includes programming of nonvolatile memory.
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
ESD CAUTION
Rev. F | Page 8 of 30
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