ADN2880ACHIPS データシートの表示（PDF） - Analog Devices
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ADN2880ACHIPS Datasheet PDF : 12 Pages
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PAD LAYOUT AND FUNCTION DESCRIPTIONS
VCC
VCC
VCCFILTER
GND
ADN2880
GND
1
17
16
15
14
IN
2
TEST
3
FILTER
4
FILTER
5
6
7
8
9
13
GND
12
OUT
11
OUTB
10
GND
GND
RSSI
CAP
GND
Figure 2. Pad Layout
Table 3. Pad Function Descriptions
Pad No.
Mnemonic Pin Type1
1
GND
P
2
IN
AI
3
TEST
AI
4, 5
FILTER
AO
6
GND
P
7
RSSI
AO
8
CAP
AI
9, 10, 13, 14 GND
P
11
OUTB
AO
12
OUT
AO
15
VCCFILTER P
16, 17
VCC
P
Description
Ground. (Input return.)
Current Input. Bond directly to a photodiode (PD) anode.
Test Probe Pad. Do not connect.
Filter Output. Pad 4 and Pad 5 are metal connected. Optional bond to a PD cathode.
Ground.
Voltage Output. Provides average input current monitoring. If not used, connect to ground.
Low Frequency Cutoff (LFC) Setpoint. For SONET applications, see Figure 10 and contact sales
for assembly details.
Ground. (Output return.)
Negative Output, CML, On-Chip 50 Ω Termination (AC or DC Termination).
Positive Output, CML, On-Chip 50 Ω Termination (AC or DC Termination).
On-Chip Filter Supply. Connect to VCC to Enable On-Chip RC Filter (200 Ω, 20 pF). Leave
unconnected if not used.
3.3 V Supply. Place a 200 pF, RF decoupling capacitor close to the power pad to reduce
the power noise.
1 P = power; AI = analog input; and AO = analog output.
Rev. 0 | Page 5 of 12
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