ADP2102-4-EVALZ(RevC) データシートの表示（PDF） - Analog Devices

部品番号

コンポーネント説明

メーカー

ADP2102-4-EVALZ
(Rev.:RevC)

Low Duty Cycle, 600 mA, 3 MHz, Synchronous Step-Down DC-to-DC Converter

Analog Devices 

ADP2102

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

AVIN, EN, MODE, FB/OUT to AGND

LX to PGND

PVIN to PGND

PGND to AGND

AVIN to PVIN

Operating Ambient Temperature Range

Junction Temperature Range

Storage Temperature Range

Soldering Conditions

Rating

−0.3 V to +6 V

−0.3 V to (VIN + 0.3 V)

−0.3 V to +6 V

−0.3 V to +0.3 V

−0.3 V to +0.3 V

−40°C to +85°C1

−40°C to +125°C

−65°C to +150°C

JEDEC J-STD-020

1 The ADP2102 can be damaged when junction temperature limits are exceeded.

Monitoring ambient temperature does not guarantee that TJ is within the

specified temperature limits. In applications where high power dissipation

and poor thermal resistance are present, the maximum ambient temperature

may have to be derated. In applications with moderate power dissipation

and low PCB thermal resistance, the maximum ambient temperature can

exceed the maximum limit as long as the junction temperature is within

specification limits. The junction temperature (TJ) of the device is dependent

on the ambient temperature (TA), the power dissipation of the device (PD),

and the junction-to-ambient thermal resistance of the package (θJA). Maximum

junction temperature (TJ) is calculated from the ambient temperature (TA)

and power dissipation (PD) using the formula TJ = TA + (θJA × PD). Unless

otherwise specified, all other voltages are referenced to AGND.

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

Data Sheet

THERMAL RESISTANCE

Junction-to-ambient thermal resistance (θJA) of the package is

based on modeling and calculation using a 4-layer board. The

junction-to-ambient thermal resistance is highly dependent on

the application and board layout. In applications where high

maximum power dissipation exists, attention to thermal board

design is required. The value of θJA may vary, depending on PCB

material, layout, and environmental conditions. Specified value

of θJA is based on a 4-layer, 4 in × 3 in, 2 1/2 oz copper board,

as per JEDEC standards. For more information, see the AN-772

Application Note, A Design and Manufacturing Guide for the

Lead Frame Chip Scale Package (LFCSP).

Table 3. Thermal Resistance

Package Type

θJA

Unit

8-Lead LFCSP

54

°C/W

Maximum Power Dissipation

0.74

W

BOUNDARY CONDITION

Natural convection, 4-layer board, exposed pad soldered to PCB.

ESD CAUTION

Rev. C | Page 4 of 24

Share Link: