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ADT7302 データシートの表示(PDF) - Analog Devices

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ADT7302 Datasheet PDF : 16 Pages
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ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
Rating
VDD to GND
−0.3 V to +7 V
Digital Input Voltage to GND
−0.3 V to VDD + 0.3 V
Digital Output Voltage to GND
−0.3 V to VDD + 0.3 V
Operating Temperature Range
−40°C to +125°C
Storage Temperature Range
−65°C to +150°C
Junction Temperature
150°C
6-Lead SOT-23 (RJ-6)
Power Dissipation1
WMAX = (TJ max − TA2)/θJA
Thermal Impedance
θJA, Junction-to-Ambient (Still Air) 190.4°C/W
8-Lead MSOP (RM-8)
Power Dissipation1
Thermal Impedance3
WMAX = (TJ max − TA2)/θJA
θJA, Junction-to-Ambient (Still Air) 205.9°C/W
θJC, Junction-to-Case
43.74°C/W
IR Reflow Soldering
Peak Temperature
220°C (0°C/5°C)
Time at Peak Temperature
10 sec to 20 sec
Ramp-up Rate
3°C/sec max
Ramp-down Rate
−6°C/sec
Time 25°C to Peak Temperature
6 minutes max
IR Reflow Soldering—Pb-Free Package
Peak Temperature
260°C (0°C)
Time at Peak Temperature
20 sec to 40 sec
Ramp-Up Rate
3°C/sec max
Ramp-Down Rate
−6°C/sec max
Time 25°C to Peak Temperature
8 minutes max
1 Values relate to the package being used on a standard 2-layer PCB. Refer
to Figure 3 for a plot of maximum power dissipation vs. ambient
temperature (TA).
2 TA = ambient temperature.
3 Junction-to-case resistance is applicable to components featuring a
preferential flow direction, for example, components mounted on a heat
sink. Junction-to-ambient resistance is more useful for air-cooled, PCB-
mounted components.
ADT7302
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability
1.2
1.0
0.8
SOT-23
0.6
0.4
MSOP
0.2
0
TEMPERATURE (°C)
Figure 3. Maximum Power Dissipation vs. Temperature
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
Rev. 0 | Page 5 of 16

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