ADT7473 データシートの表示（PDF） - ON Semiconductor

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ADT7473

dBCOOL® Remote Thermal Monitor and Fan Control

ON Semiconductor 

ADT7473

*ADDREN *ADDR SELECT SCL SDA SMBALERT

ADT7473/ADT7473−1

SMBus

ADDRESS

SELECTION

SERIAL BUS

INTERFACE

PWM1

PWM2

PWM3

PWM

REGISTERS

AND

CONTROLLERS

(HF AND LF)

ACOUSTIC

ENHANCEMENT

CONTROL

TACH1

TACH2

TACH3

TACH4

FAN

SPEED

COUNTER

PERFORMANCE

MONITORING

*THERM_LATCH

THERMAL

VCC TO ADT7473/ADT7473−1 PROTECTION

VCC

D1+

D1–

D2+

D2–

VCCP

SRC

BAND GAP

TEMP SENSOR

INPUT

SIGNAL

CONDITIONING

AND

ANALOG

MULTIPLEXER

AUTOMATIC

FAN SPEED

CONTROL

DYNAMIC

TMIN

CONTROL

10−BIT

ADC

BAND GAP

REFERENCE

ADDRESS

POINTER

REGISTER

PWM

CONFIGURATION

REGISTERS

INTERRUPT

MASKING

INTERRUPT

STATUS

REGISTERS

LIMIT

COMPARATORS

VALUE AND

LIMIT

REGISTERS

GND

*PIN FUNCTION ONLY AVAILABLE ON THE ADT7473−1

Figure 1. Functional Block Diagram

ABSOLUTE MAXIMUM RATINGS

Parameter

Rating

Unit

Positive Supply Voltage (VCC)

Voltage on any Input or Output Pin

3.6

V

−0.3 to +3.6

V

Input Current at any Pin

±5.0

mA

Package Input Current

±20

mA

Maximum Junction Temperature (TJ max)

150

°C

Storage Temperature Range

−65 to +150

°C

Lead Temperature, Soldering

°C

IR Reflow Peak Temperature

260

Lead Temperature (Soldering, 10 sec)

300

ESD Rating

1500

V

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

NOTE: This device is ESD sensitive. Use standard ESD precautions when handling.

THERMAL CHARACTERISTICS

Package Type

qJA

qJC

Unit

16−lead QSOP

150

39

°C/W

NOTE: qJA is specified for the worst−case conditions, that is, a device soldered in a circuit board for surface−mount packages.

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