ADV7614BBCZ データシートの表示（PDF） - Analog Devices

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ADV7614BBCZ

12-Bit Deep Color with Quad HDMI Receiver

Analog Devices 

ADV7614

ABSOLUTE MAXIMUM RATINGS

Table 4.

Parameter

DVDD to GND

PVDD to GND

DVDDIO to GND

CVDD to GND

TVDD to GND

Digital Inputs Voltage to GND

5 V Tolerant Digital Inputs to GND1

Digital Output Voltage to GND

XTAL Pins

Maximum Junction Temperature (TJ MAX)

Storage Temperature

Infrared Reflow Soldering (20 sec)

Rating

2.2 V

2.2 V

4.0 V

2.2 V

4.0 V

GND − 0.3 V to

DVDDIO + 0.3 V

5.3 V

GND − 0.3 V to

DVDDIO + 0.3 V

−0.3 V to PVDD

to 0.3 V

125°C

150°C

260°C

1 The following inputs are 3.3 V inputs but are 5 V tolerant: DDCA_SCL,

DDCA_SDA, DDCB_SCL, DDCB_SDA, DDCC_SCL, DDCC_SDA, DDCD_SCL,

DDCD_SDA, RXA_5V, RXB_5V, RXC_5V, RXD_5V, SHARED_EDID, PWRDN,

EP_MISO.

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these orany

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

Data Sheet

PACKAGE THERMAL PERFORMANCE

To reduce powerconsumption when using the ADV7614, the

user is advised to turn off unused sections of the part.

Due to printed circuit board (PCB) metal variation and, thus,

variation in PCB heat conductivity, the value of θJA may differ

for various PCBs.

The most efficient measurement solution is obtainedusing the

package surface temperature to estimate the die temperature

because this eliminatesthe variance associated with the θJA value.

The maximum junction temperature (TJ MAX) of 125°C must not

be exceeded. The following equation calculatesthe junction

temperature using the measuredpackage surface temperature

and applies only when no heat sink is used on the device under

test (DUT):

TJ = TS + (ΨJT × WTOTAL)

where:

TS is the package surface temperature (°C).

ΨJT = 0.3°C/W for a 260-ball CSP_BGA.

WTOTAL = ((PVDD × IPVDD) + (0.05 × TVDD × ITVDD) + (CVDD ×

ICVDD) + (DVDD × IDVDD) + (DVDDIO × IDVDDIO)).

Note that for WTOTAL, 5% of TVDD power is dissipated on the

part itself.

ESD CAUTION

Rev. C | Page 8 of 20

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