AG606 データシートの表示（PDF） - WJ Communications => Triquint
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AG606 Datasheet PDF : 5 Pages
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AG606
Push-Pull CATV Amplifier
The Communications Edge TM
Product Information
AG606-G (Lead-Free Package) Mechanical Information
This package is lead-free/green/RoHS-compliant. The plating material on the leads is NiPdAu. It is compatible with both lead-free
(maximum 260 qC reflow temperature) and lead (maximum 245 qC reflow temperature) soldering processes.
Outline Drawing
Product Marking
The component will be marked with an
“AG606G” designator with an alphanumeric
lot code on the top surface of the package.
The obsolete tin-lead package is marked with
an “AG606” designator followed by an
alphanumeric lot code.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
Land Pattern
Thermal Specifications
Parameter
Rating
10000
Operating Case Temperature
-40 to +85 qC
1000
Thermal Resistance, Rth (1)
63 qC/W
Junction Temperature, Tj (2)
142 qC
100
Notes:
10
1. The thermal resistance is referenced from the hottest part
of the junction to ground tab underneath the device.
1
2. This corresponds to the typical biasing condition of
50
+5.16V, 175 mA at an 85 ¥ C case temperature. A
minimum MTTF of 1 million hours is achieved for
junction temperatures below 177 ¥ C.
MTTF vs. GND Tab Temperature
ESD / MSL Information
ESD Rating:
Value:
Test:
Standard:
Class 1C
1000 to 2000 V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
ESD Rating:
Value
Test:
Standard:
Class IV
Passes greater than 1000 V
Charge Device Model (CDM)
JEDEC Standard JESD22-C101
MSL Rating: Level 2 at +260 ¥ C convection reflow
Standard: JEDEC Standard J-STD-020A
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper performance
of this device. Vias should use a .35mm (#80/.0135” )
diameter drill and have a final plated through diameter of
.25mm (.010” )
2. Add as much copper as possible to inner and outer layers
near the part to ensure optimal thermal performance.
3. To ensure reliable operation, device ground paddle-to-
ground pad solder joint is critical.
4. Add mounting screws near the part to fasten the board to a
heatsink. Ensure that the ground / thermal via region
contacts the heatsink.
5. For optimal thermal performance, expose soldermask on
backside where it contacts the heatsink.
6. RF trace width depends upon the PC board material and
construction.
7. Use 1 oz. Copper minimum.
8. If the PCB design rules allow, ground vias should be placed
under the land pattern for better RF and thermal
performance. Otherwise ground vias should be placed as
close to the land pattern as possible.
9. All dimensions are in mm. Angles are in degrees.
60
70
80
90
100
Tab Temperature (°C)
Specifications and information are subject to change without notice.
WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com
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Page 5 of 5 April 2006
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