AH101-G データシートの表示（PDF） - WJ Communications => Triquint

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AH101-G

Medium Power, High Linearity Amplifier

WJ Communications => Triquint 

AH101

Medium Power, High Linearity Amplifier

The Communications Edge TM

Product Information

AH101-G (Green / Lead-free SOT-89 Package) Mechanical Information

This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260 qC reflow temperature) and leaded

(maximum 245 qC reflow temperature) soldering processes. The plating material on the leads is NiPdAu.

Outline Drawing

Product Marking

The AH101-G will be marked with an

“101G” designator. An alphanumeric lot

code (“XXXX-X” ) is also marked below the

part designator on the top surface of the

package. The obsolete tin-lead package is

marked with an “AH101” designator

followed by an alphanumeric lot code.

Tape and reel specifications for this part are

located on the website in the “Application

Notes” section.

Land Pattern

MSL / ESD Rating

ESD Rating: Class 1C

Value:

Passes 1000V min.



Test:

Human Body Model (HBM)

Standard: JEDEC Standard JESD22-A114

ESD Rating: Class IV

Value:

Passes 1000V min.



Test:

Charged Device Model (CDM)

Standard: JEDEC Standard JESD22-C101

MSL Rating: Level 3 at +260 C convection reflow

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Standard: JEDEC Standard J-STD-020

Thermal Specifications

Parameter

Operating Case Temperature

Thermal Resistance, Rth (1)

Junction Temperature, Tj (2)

Rating

-40 to +85 qC

25 qC / W

130 qC

1. The thermal resistance is referenced from the hottest

part of the junction to the ground tab (pin 4).

2. This corresponds to the typical biasing condition of

+9V, 200 mA at an 85 C case temperature. A

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minimum MTTF of 1 million hours is achieved for

junction temperatures below 160 C.

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MTTF vs. GND Tab Temperature

1000

100

10

Mounting Config. Notes

1. Ground / thermal vias are critical for the proper

performance of this device. Vias should use a .35mm

(#80 / .0135” ) diameter drill and have a final plated

thru diameter of .25 mm (.010” ).

2. Add as much copper as possible to inner and outer

layers near the part to ensure optimal thermal

performance.

3. Mounting screws can be added near the part to fasten

the board to a heatsink. Ensure that the ground /

thermal via region contacts the heatsink.

4. Do not put solder mask on the backside of the PC board

in the region where the board contacts the heatsink.

5. RF trace width depends upon the PC board material

and construction.

6. Use 1 oz. Copper minimum.

7. All dimensions are in millimeters (inches). Angles are

in degrees.

1

60 70 80 90 100 110 120

Tab Temperature (°C)

Specifications and information are subject to change without notice

WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com

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Page 5 of 5 June 2006

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