AH1-PCB データシートの表示（PDF） - WJ Communications => Triquint

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AH1-PCB

High Dynamic Range Amplifier

WJ Communications => Triquint 

AH1

High Dynamic Range Amplifier

The Communications Edge TM

Product Information

AH1-G (Green / Lead-free SOT-89 Package) Mechanical Information

This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260 °C reflow temperature) and leaded

(maximum 245 °C reflow temperature) soldering processes. The plating material on the leads is NiPdAu.

Outline Drawing

Product Marking

The AH1-G will be marked with an “AH1G”

designator. An alphanumeric lot code

(“XXXX-X”) is also marked below the part

designator on the top surface of the package.

The obsolete tin-lead package is marked with

an “AH1” designator followed by an

alphanumeric lot code.

Tape and reel specifications for this part are

located on the website in the “Application

Notes” section.

MSL / ESD Rating

Land Pattern

ESD Rating: Class 1B

Value:

Passes 500V to <1000V

Test:

Human Body Model (HBM)

Standard: JEDEC Standard JESD22-A114

ESD Rating: Class IV

Value:

Passes 1000V to <2000V

Test:

Charged Device Model (CDM)

Standard: JEDEC Standard JESD22-C101

MSL Rating: Level 3 at +260 °C convection reflow

Standard: JEDEC Standard J-STD-020

Thermal Specifications

Parameter

Rating

MTTF vs. GND Tab Temperature

1000

Operating Case Temperature

Thermal Resistance, Rth (1)

Junction Temperature, Tj (2)

-40 to +85 °C

59 °C / W

100

129 °C

10

1. The thermal resistance is referenced from the hottest

part of the junction to the ground tab (pin 4).

2. This corresponds to the typical biasing condition of

+5V, 150 mA at an 85 °C case temperature. A

minimum MTTF of 1 million hours is achieved for

junction temperatures below 160 °C.

1

60 70 80 90 100 110

Tab Temperature (°C)

Mounting Config. Notes

1. Ground / thermal vias are critical for the proper performance of

this device. Vias should use a .35mm (#80 / .0135”) diameter

drill and have a final plated thru diameter of .25 mm (.010”).

2. Add as much copper as possible to inner and outer layers near

the part to ensure optimal thermal performance.

3. Mounting screws can be added near the part to fasten the board

to a heatsink. Ensure that the ground / thermal via region

contacts the heatsink.

4. Do not put solder mask on the backside of the PC board in the

region where the board contacts the heatsink.

5. RF trace width depends upon the PC board material and

construction.

6. Use 1 oz. Copper minimum.

7. All dimensions are in millimeters (inches). Angles are in

degrees.

Specifications and information are subject to change without notice.

WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com

Page 5 of 5 July 2006

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