AH212-EPCB1960 データシートの表示（PDF） - WJ Communications => Triquint

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AH212-EPCB1960

1 Watt High Linearity, High Gain InGaP HBT Amplifier

WJ Communications => Triquint 

AH212

The Communications Edge TM

1 Watt High Linearity, High Gain InGaP HBT Amplifier

Product Information

AH212-S8G (Lead-Free SOIC-8 Package) Mechanical Information

This package is lead-free/green/RoHS-compliant. The plating material on the leads is NiPdAu. It is compatible with both lead-free

(maximum 260 C reflow temperature) and lead (maximum 245 C reflow temperature) soldering processes.

Outline Drawing

Product Marking

The component will be marked with an

“AH212G” designator with an alphanumeric lot

code on the top surface of the package.

Tape and reel specifications for this part are

located on the website in the “Application

Notes” section.

ESD / MSL Information

Mounting Configuration / Land Pattern

Thermal Specifications

Parameter

Rating

Operating Case Temperature

-40 to +85C

Thermal Resistance, Rth (1)

33 C / W

Junction Temperature, Tj (2)

156 C

Notes:

1. The thermal resistance is referenced from the junction-to-case at a case

temperature of 85 C. Tj is a function of the voltage and the current applied. It

can be calculated by:

Tj = Tcase + Rth * Vcc * Icc

2. This corresponds to the typical biasing condition of +5V, 400 mA at an 85 C

case temperature.

ESD Rating:

Value:

Test:

Standard:

Class 1B

Passes 500V to <1000V

Human Body Model (HBM)

JEDEC Standard JESD22-A114

ESD Rating:

Value:

Test:

Standard:

Class IV

Passes ≥ 2000V min.

Charged Device Model (CDM)

JEDEC Standard JESD22-C101

MSL Rating: Level 2 at +260 C convection reflow

Standard: JEDEC Standard J-STD-020

Mounting Config. Notes

1. A heatsink underneath the area of the PCB for the mounted device

is recommended for proper thermal operation. Damage to the

device can occur without the use of one.

2. Ground / thermal vias are critical for the proper performance of this

device. Vias should use a .35mm (#80 / .0135”) diameter drill and

have a final plated thru diameter of .25 mm (.010”).

3. Add as much copper as possible to inner and outer layers near the

part to ensure optimal thermal performance.

4. Mounting screws can be added near the part to fasten the board to a

heatsink. Ensure that the ground / thermal via region contacts the

heatsink.

5. Do not put solder mask on the backside of the PC board in the

region where the board contacts the heatsink.

6. RF trace width depends upon the PC board material and

construction.

7. Use 1 oz. Copper minimum.

8. All dimensions are in millimeters

Functional Pin Layout

Vcc1 1

Vbias1 2

RF In 3

Vbias2 4

8 N/C

7

Vcc2 / RF Out

6 Vcc2 / RF Out

5 N/C

Function

Vcc1

Input

Output/ Vcc2

Vbias1

Vbias2

GND

N/C or GND

Pin No.

1

3

6, 7

2

4

Backside Paddle

5, 8

Specifications and information are subject to change without notice.

WJ Communications, Inc  Phone 1-800-WJ1-4401  FAX: 408-577-6621  e-mail: sales@wj.com  Web site: www.wj.com

Page 11 of 12 August 2006

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