AM29F200BB-75 データシートの表示（PDF） - Advanced Micro Devices
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AM29F200BB-75
Advanced Micro Devices
AM29F200BB-75 Datasheet PDF : 10 Pages
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SUPPLEMENT
REVISION SUMMARY
Revision A (1997)
Initial release.
Revision B (December 1997)
Formatted for 1998 flash data book.
Revision C (November 1998)
Global
Formatted to match current template. Modified
Am29F200A data sheet for CS39S process technology.
Terms and Conditions
Replaced warranty with new version.
Revision D (December 1998)
Global
Added -75 speed option.
Ordering Information
Changed Gel-Pak quantity to 486. Corrected Surftape
reel size to 7 inches.
Packaging Information
Added section. Moved orientation information from die
photograph section into this section.
Revision D+1 (June 14, 1999)
Physical Specifications
Corrected bond pad dimensions and deleted Si from
the bond pad metalization specification.
Revision D+2 (July 12, 1999)
Global
The device is now available in the high temperature
range (–55°C to +140°C). TJ (max) for this range is
+145°C.
Revision D+3 (November 17, 1999)
Global
Replaced references to high temperature ratings with a
note to contact AMD for such devices.
Revision D+4 (June 27, 2001)
Manufacturing Information
Added Penang, Malaysia as a test facility (ACN2016).
Trademarks
Copyright © 2001 Advanced Micro Devices, Inc. All rights reserved.
AMD, the AMD logo, and combinations thereof are registered trademarks of Advanced Micro Devices, Inc.
Product names used in this publication are for identification purposes only and may be trademarks of their respective companies.
10
Am29F200B Known Good Die
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