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AM29F200BB-75 データシートの表示(PDF) - Advanced Micro Devices

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AM29F200BB-75 Datasheet PDF : 10 Pages
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SUPPLEMENT
ORDERING INFORMATION
Standard Products
AMD standard products are available in several packages and operating ranges. The order number (Valid Combination) is
formed by a combination of the following:
Am29F200B
T -75 DP C 1
DIE REVISION
This number refers to the specific AMD manufacturing process and
product technology reflected in this document. It is entered in the
revision field of AMD standard product nomenclature.
TEMPERATURE RANGE
C = Commercial (0°C to +70°C)
I
= Industrial (–40°C to +85°C)
E
= Extended (–55°C to +125°C)
Contact AMD for higher temperature range devices.
PACKAGE TYPE AND
MINIMUM ORDER QUANTITY
DP = Waffle Pack
245 die per 5 tray stack
DG = Gel-Pak® Die Tray
486 die per 6 tray stack
DT = Surftape™ (Tape and Reel)
2500 per 7-inch reel
DW = Gel-Pak® Wafer Tray (sawn wafer on frame)
Call AMD sales office for minimum order quantity
SPEED OPTION
See Product Selector Guide and Valid Combinations
BOOT CODE SECTOR ARCHITECTURE
T = Top sector
B = Bottom sector
DEVICE NUMBER/DESCRIPTION
Am29F200B Known Good Die
2 Megabit (256 K x 8-Bit/128 K x 16-Bit) CMOS Flash Memory—Die Revision 1
5.0 Volt-only Program and Erase
Valid Combinations
AM29F200BT-75,
AM29F200BB-75
(70 ns, VCC = 5.0 V ±5%)
AM29F200BT-90,
AM29F200BB-90
AM29F200BT-120,
AM29F200BB-120
DPC 1, DPI 1, DPE 1,
DGC 1, DGI 1, DGE 1,
DTC 1, DTI 1, DTE 1,
DWC 1, DWI 1, DWE 1
Valid Combinations
Valid Combinations list configurations planned to be sup-
ported in volume for this device. Consult the local AMD sales
office to confirm availability of specific valid combinations and
to check on newly released combinations.
Am29F200B Known Good Die
5

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