AM29F200BB-75 データシートの表示（PDF） - Advanced Micro Devices

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AM29F200BB-75

2 Megabit (256 K x 8-Bit/128 K x 16-Bit) CMOS 5.0 Volt-only, Sectored Flash Memory—Die Revision 1

Advanced Micro Devices 

SUPPLEMENT

PHYSICAL SPECIFICATIONS

Die dimensions . . . . . . . . . . . . . . 135 mils x 150 mils

. . . . . . . . . . . . . . . . . . . . . . . . . . . 3.43 mm x 3.81 mm

Die Thickness. . . . . . . . . . . . . . . . . . . . . . . . 19.7 mils

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .500 µm

Bond Pad Size . . . . . . . . . . . . . . 4.69 mils x 4.69 mils

. . . . . . . . . . . . . . . . . . . . . . . . . . 115.9 µm x 115.9 µm

Pad Area Free of Passivation . . . . . . . . . .13.99 mils2

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9,025 µm2

Pads Per Die . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .42

Bond Pad Metalization . . . . . . . . . . . . . . . . . . . . Al/Cu

Die Backside . . . . . . . . . . . . . . . . . . . . . . . . No metal,

may be grounded (optional)

Passivation . . . . . . . . . . . . . . . . . . Nitride/SOG/Nitride

DC OPERATING CONDITIONS

VCC (Supply Voltage) . . . . . . . . . . . . . . . 4.5 V to 5.5 V

Junction Temperature Under Bias:

Commerical, Industrial, and

Extended Temperature Range . . . . .TJ (max) = 130°C

Operating Temperature

Commercial . . . . . . . . . . . . . . . . . . . 0°C to +70°C

Industrial . . . . . . . . . . . . . . . . . . . –40°C to +85°C

Extended . . . . . . . . . . . . . . . . . . –55°C to +125°C

Contact AMD for higher temperature range devices.

MANUFACTURING INFORMATION

Manufacturing . . . . . . . . . . . . . . . . . . . . . . . . . . FASL

Wafer Sort Test . . . . . . . . . . . . . Sunnyvale, CA, USA,

. . . . . . . . . . . . . . . . . . . . . . . . .and Penang, Malaysia

Manufacturing ID (Top Boot) . . . . . . . . . . . . 98480AK

(Bottom Boot) . . . . . . . .98480ABK

Preparation for Shipment . . . . . . . . Penang, Malaysia

Fabrication Process . . . . . . . . . . . . . . . . . . . . CS39S

Die Revision . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

SPECIAL HANDLING INSTRUCTIONS

Processing

Do not expose KGD products to ultraviolet light or

process them at temperatures greater than 250°C.

Failure to adhere to these handling instructions will

result in irreparable damage to the devices. For best

yield, AMD recommends assembly in a Class 10K

clean room with 30% to 60% relative humidity.

Storage

Store at a maximum temperature of 30°C in a nitrogen-

purged cabinet or vacuum-sealed bag. Observe all

standard ESD handling procedures.

8

Am29F200B Known Good Die

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