AME8819BEGA300Z データシートの表示（PDF） - AME, Inc

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AME8819BEGA300Z

Low Dropout 600mA CMOS Regulator

AME, Inc 

AME

AME8819

Low Dropout

600mA CMOS Regulator

n Thermal Information

Parameter

Thermal Resistance

(Junction to Case)

Package

SOT-89*

SOT-223*

SOP-8**

Die Attach Symbol Maximum

Conductive Epoxy

40

Non-Conductive

46

Epoxy

Conductive Epoxy

θJC

25

Non-Conductive

31

Epoxy

Conductive Epoxy

60

Unit

oC / W

Thermal Resistance

(Junction to Ambient)

SOT-89

Conductive Epoxy

Non-Conductive

Epoxy

Conductive Epoxy

θJA

SOT-223

Non-Conductive

Epoxy

SOP-8

Conductive Epoxy

180

180

120

oC / W

135

150

SOT-89

Conductive Epoxy

Non-Conductive

Epoxy

Internal Power Dissipation

Conductive Epoxy

PD

SOT-223

Non-Conductive

Epoxy

SOP-8

Conductive Epoxy

Maximum Junction Temperature

Solder Iron(10 Sec)***

550

550

900

mW

800

810

150

oC

350

oC

* Measure θJC on backside center of tab.

** Measure θJC on center of molding compound if IC has no tab.

*** MIL-STD-202G 210F

Rev.B.01

9

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