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AMMC-5620 データシートの表示(PDF) - HP => Agilent Technologies

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AMMC-5620
HP
HP => Agilent Technologies HP
AMMC-5620 Datasheet PDF : 9 Pages
1 2 3 4 5 6 7 8 9
875 (VDD)
1010
910
350 (RFIn)
0
0 90
Figure 20. AMMC-5620 Bond Pad Locations.
(dimensions in microns)
Ordering Information:
AMMC-5620-W10 = waffle pack, 10 devices per tray
AMMC-5620-W50 = waffle pack, 50 devices per tray
350 (RFOut)
1315
1410
www.agilent.com/semiconductors
For product information and a complete list of
distributors, please go to our web site.
Data subject to change.
Copyright 2003 Agilent Technologies, Inc.
May 21, 2004
5989-0530EN

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