AO4946L データシートの表示（PDF） - Alpha and Omega Semiconductor
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AO4946L Datasheet PDF : 5 Pages
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II. Die / Package Information:
Process
Package Type
Lead Frame
Die Attach
Bond wire
Mold Material
Filler % (Spherical/Flake)
Flammability Rating
Backside Metallization
Moisture Level
AO4946
AO4946L (Green Compound)
Standard sub-micron
Standard sub-micron
low voltage N channel process low voltage N channel process
8 leads SOIC
8 leads SOIC
Copper with Ag spot
Copper with Ag spot
Ag epoxy
Ag epoxy
S：2mils Cu; G: 1.3mils Au S：2mils Cu; G: 1.3mils Au
Epoxy resin with silica filler Epoxy resin with silica filler
90/10
100/0
UL-94 V-0
UL-94 V-0
Ti / Ni / Ag
Ti / Ni / Ag
Up to Level 1 *
Up to Level 1*
Note * based on info provided by assembler and mold compound supplier
III. Result of Reliability Stress for AO4946 (Standard) & AO4946L (Green)
Test Item
Test Condition
Solder
Reflow
Precondition
HTGB
Standard: 1hr PCT+3
cycle reflow@260°c
Green: 168hr 85°c
/85%RH +3 cycle
reflow@260°c
Temp = 150°c ,
Vgs=100% of Vgsmax
Time
Point
0hr
168 / 500
hrs
1000 hrs
Lot Attribution
Standard: 83 lots
Green: 29 lots
Total
Sample
size
17380 pcs
Number
of
Failures
0
1 lot
82 pcs
0
(Note A*)
77+5 pcs /
lot
HTRB
Temp = 150°c ,
168 / 500
1 lot
82 pcs
0
Vds=80% of Vdsmax
hrs
77+5 pcs /
1000 hrs
(Note A*)
lot
HAST
130 +/- 2°c , 85%RH,
100 hrs
Standard: 81 lots 5335 pcs
0
33.3 psi, Vgs = 80% of
Green: 16 lots
Vgs max
50+5 pcs /
(Note B**)
lot
Pressure Pot 121°c , 29.7 psi ,
96 hrs
Standard: 83 lots 5665 pcs
0
100%RH
Green: 20 lots
50+5 pcs /
(Note B**)
lot
Temperature -65°c to 150°c ,
250 / 500
Standard: 87 lots 6380 pcs
0
Cycle
air to air
cycles
Green: 29 lots
50+5 pcs /
(Note B**)
lot
3
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