AP2166(2009) データシートの表示（PDF） - Diodes Incorporated.

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AP2166
(Rev.:2009)

1A DUAL CHANNEL CURRENT-LIMITED POWER SWITCH

Diodes Incorporated. 

Electrical Characteristics

AP2166/AP2176

1A DUAL CHANNEL CURRENT-LIMITED POWER

SWITCH

(TA = 25oC, CIN = 10μF, VIN = +5.0V, unless otherwise stated)

Symbol

Parameter

Test Conditions

Min Typ. Max Unit

VUVLO Input UVLO

Rload=1kΩ

1.6 1.9 2.5 V

ISHDN Input Shutdown Current

Disabled, IOUT= 0

0.5 1 μA

IQ Input Quiescent Current, Dual Enabled, IOUT= 0

95 140 μA

ILEAK Input Leakage Current

Disabled, OUT grounded

1 μA

IREV Reverse Leakage Current

Disabled, VIN = 0V, VOUT = 5V, IREV at VIN

1

μA

RDS(ON) Switch on-resistance

VIN = 5V, IOUT= 1A,

MSOP-8L-EP

-40oC≤ TA ≤85oC

SOP-8L

VIN = 3.3V, IOUT= 1A, -40oC≤ TA ≤85oC

90 135 mΩ

100 135 mΩ

120 160 mΩ

ISHORT Short-circuit current limit

ILIMIT Over-Load Current Limit

ITrig

Current limiting trigger

threshold

Enabled into short circuit, CL=68μF

1.5

A

VIN = 5V, VOUT = 4.6V, CL=120μF, -40oC≤

TA ≤85oC

1.1

1.5

1.9

A

VIN = VEN, Output Current Slew rate

(<100A/s), CL=68μF

2.0

A

TSHORT Short-circuit Response Time

VIL EN Input Logic Low Voltage

VOUT = 0V to IOUT = ILIMIT (short applied to

output), CL = 68μF

VIN = 2.7V to 5.5V

20

μs

0.8 V

VIH EN Input Logic High Voltage VIN = 2.7V to 5.5V

2

V

ISINK EN Input leakage

VEN = 5V

1 μA

TD(ON) Output turn-on delay time

CL=1μF, Rload=10Ω

0.05

ms

TR Output turn-on rise time

CL=1μF, Rload=10Ω

0.6 1.5 ms

TD(OFF) Output turn-off delay time

CL=1μF, Rload=10Ω

0.01

ms

TF Output turn-off fall time

CL=1μF, Rload=10Ω

0.05 0.1 ms

RFLG FLG output FET on-resistance IFLG =10mA

20 40 Ω

IFOH Error Flag Off Current

VFLG=5V

0.01 1 μA

TBlank FLG blanking time

CL=68μF

4 7 15 ms

TSHDN Thermal shutdown threshold Enabled, Rload=1kΩ

140

°C

THYS Thermal shutdown hysteresis

25

°C

θJA

Thermal Resistance

Junction-to-Ambient

SOP-8L (Note 4)

MSOP-8L-EP (Note 5)

110

oC/W

60

oC/W

Notes:

4. Test condition for SOP-8L: Device mounted on FR-4 2-layer board, 2oz copper, with minimum recommended pad layout.

5. Test condition for MSOP-8L-EP: Device mounted on FR-4 2-layer board, 2oz copper, with minimum recommended pad on top layer and 3

vias to bottom layer ground plane.

AP2166/AP2176 Rev 1

5 of 17

www.diodes.com

APRIL 2009

© Diodes Incorporated

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