APA2037 データシートの表示（PDF） - Anpec Electronics

部品番号

コンポーネント説明

メーカー

APA2037

3W Stereo Fully Differential Audio Power Amplifier

Anpec Electronics 

APA2037

Ordering and Marking Information

APA2037

Assembly Material

Handling Code

Temperature Range

Package Code

Package Code

QB : TQFN5x5-20A

Operating Ambient Temperature Range

I : -40 to 85°C

Handling Code

TR : Tape & Reel

Assembly Material

L : Lead Free Device G : Halogen and Lead Free Device

APA2037 QB :

APA2037

XXXXX

XXXXX - Date Code

Note : ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish;

which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-

020C for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and

halogen free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed

1500ppm by weight).

Absolute Maximum Ratings (Note 1)

(Over operating free-air temperature range unless otherwise noted.)

Symbol

VDD

Parameter

Supply Voltage (LVDD, RVDD to GND)

Rating

Unit

-0.3 to 6

V

VIN

Input Voltage (LINN, LINP, RINN, RINP, LSD, RSD to GND)

-0.3 to VDD+0.3

V

TJ

TSTG

TSDR

Maximum Junction Temperature

Storage Temperature Range

Maximum Lead Soldering Temperature, 10 Seconds

150

οC

-65 to +150

οC

260

οC

PD

Power Dissipation

Internally Limited

W

Note 1: Absolute Maximum Ratings are those values beyond which the life of a device may be impaired. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

Thermal Characteristics

Symbol

Parameter

Typical Value

Unit

θJA

Thermal Resistance -Junction to Ambient

θJC

Thermal Resistance -Junction to Case

TQFN5x5-20A (Note 2)

40

TQFN5x5-20A (Note 3)

8

οC/W

οC/W

Note 2: Please refer to “ Layout Recommendation”, the Thermal Pad on the bottom of the IC should soldered directly to the PCB’s

ThermalPad area that with several thermal vias connect to the ground plan, and the PCB is a 2-layer, 5-inch square area with

2oz copper thickness.

Note 3: The case temperature is measured at the center of the Thermal Pad on the underside of the TQFN5X5-32A package.

Copyright © ANPEC Electronics Corp.

2

Rev. A.2 - Aug., 2008

www.anpec.com.tw

Share Link: