DatasheetQ Logo
Electronic component search and free download site. Transistors,MosFET ,Diode,Integrated circuits

APL1117-GC-TU データシートの表示(PDF) - Anpec Electronics

部品番号
コンポーネント説明
メーカー
APL1117-GC-TU Datasheet PDF : 18 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
APL1117
Application Information (Cont.)
Output Capacitor (Cont.)
Aluminum electrolytics can also be used, as long as
the ESR of the capacitor is <1. The value of the
output capacitor can be increased without limit. Higher
capacitance values help to improve transient response
and ripple rejection and reduce output noise.
Ripple Rejection
The curves for Ripple Rejection were generated us-
ing an adjustable device with the adjust pin bypassed.
With a 22µF bypassing capacitor 75dB ripple rejec-
tion is obtainable at any output level. The impedance
of the adjust pin capacitor, at the ripple frequency,
should be < R1. R1 is normally in the range of 100-
200. The size of the required adjust pin capacitor
is a function of the input ripple frequency. At 120Hz,
with R1=100, the adjust pin capacitor should be
13µF. For fixed voltage devices, and adjustable de-
vices without an adjust pin capacitor, the output ripple
will increase as the ratio of the output voltage to the
reference voltage (VOUT /VREF ).
Figure 3&4 shows for the TO-252 and SOT-223 the
measured values of θ(J-A) for different copper area
sizes using a 2 layers, 1.6mm, and 6Sq. cm FR-4
PCB with 2oz. copper and a ground plane layer on
the backside area used for heatsinking. It can be
used as a rough guideline in estimating thermal
resistance.
50
TA=25°C
45
40
35
30
25
0
2
4
6
8
10 12 14
Top Copper Area (cm2)
Figure 3.
θ(J-A) vs. copper area for the SOT-252 package
Thermal Considerations
APL1117 has thermal protection which limits junction
temperature to 150°C. However, device functionality
is only guaranteed to a maximum junction tempera-
ture of +125°C.
Both the TO-220, TO-252, TO-263 and SOT-223
packages use a copper plane on the PCB and the
PCB itself as a heatsink. To optimize the heat sinking
ability of the plane and PCB, solder the tab of the
package to the plane.
Copyright ANPEC Electronics Corp.
10
Rev. B.8 - Jun., 2003
www.anpec.com.tw

Share Link: 

datasheetq.com  [ Privacy Policy ]Request Datasheet ] [ Contact Us ]