AS1340 データシートの表示（PDF） - austriamicrosystems AG
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AS1340 Datasheet PDF : 17 Pages
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AS1340
Datasheet - Absolute Maximum Ratings
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of
the device at these or any other conditions beyond those indicated in Electrical Characteristics on page 4 is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Table 2. Absolute Maximum Ratings
Parameter
Electrical Parameters
VCC, FB, EN to GND
Min
Max
Units
-0.3
7
Comments
SWVIN, SWOUT to GND
LX to GND
-0.3
7
V
55
Input Current (latch-up immunity)
Electrostatic Discharge
-100
100
mA
Norm: JEDEC 78
Electrostatic Discharge HBM
Temperature Ranges and Storage Conditions
Thermal Resistance JA
Junction Temperature
1.5
kV
36.7
ºC/W
+150
ºC
Norm: MIL 883 E method 3015
on PCB
Storage Temperature Range
-55
+125
ºC
Package Body Temperature
The reflow peak soldering temperature (body
temperature) specified is in accordance with IPC/
JEDEC J-STD-020“Moisture/Reflow Sensitivity
+260
ºC
Classification for Non-Hermetic Solid State Surface
Mount Devices”.
The lead finish for Pb-free leaded packages is matte tin
(100% Sn).
Humidity non-condensing
5
85
%
Moisture Sensitive Level
1
Represents a max. floor life time of unlimited
www.ams.com/DC-DC_Step-Up/AS1340
Revision 1.20
3 - 17
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