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AS1341-BTDT(2007) データシートの表示(PDF) - austriamicrosystems AG

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AS1341-BTDT
(Rev.:2007)
AmsAG
austriamicrosystems AG AmsAG
AS1341-BTDT Datasheet PDF : 16 Pages
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AS1341
Data Sheet - Absolute Maximum Ratings
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond those indicated in Electrical Character-
istics on page 4 is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Table 2. Absolute Maximum Ratings
Parameter
Min Max Units
Comments
IN to GND
-0.3 +23
V
LX to GND
-2
VIN
+ 0.3
V
FB to GND
-0.3 +5
V
ILIMIT, SHDNN, OUT, POK to GND
-0.3
VIN
+ 0.3
V
Peak Input Current
Thermal Resistance ΘJA
Operating Temperature Range
Storage Temperature Range
Junction Temperature
Package Body Temperature
2
A
36.3 ºC/W
on PCB
-40 +85 ºC
-65 +150 ºC
+150 ºC
+260
The reflow peak soldering temperature (body
temperature) specified is in accordance with
IPC/JEDEC J-STD-020C “Moisture/Reflow
ºC Sensitivity Classification for Non-Hermetic
Solid State Surface Mount Devices”.
The lead finish for Pb-free leaded packages is
matte tin (100% Sn).
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