5962-9669201HTA データシートの表示（PDF） - Austin Semiconductor
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5962-9669201HTA Datasheet PDF : 27 Pages
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Austin Semiconductor, Inc.
FLASH
AS29F040
DEVICE BUS OPERATIONS
This section describes the requirements and use of the
device bus operations, which are initiated through the internal
command register. The command register itself does not
occupy any addressable memory location. The register is
composed of latches that store the commands, along with the
address and data information needed to execute the command.
The contents of the register serve as inputs to the internal state
machine. The state machine outputs dictate the function of the
device. The appropriate device bus operations table lists the
inputs and control levels required, and the resulting output.
The following subsections describe each of these operations
in further detail.
Requirements for Reading Array Data
To read array data from the outputs, the system must drive
the CE\ and OE\ pins to VIL. CE\ is the power control and
selects the device. OE\ is the output control and gates array
data to the output pins. WE\ should remain at VIH.
The internal state machine is set for reading array data
upon device power-up, or after a hardware reset. This ensures
that no spurious alteration of the memory content occurs
during the power transition. No command is necessary in this
mode to obtain array data. Standard microprocessor read cycles
that assert valid addresses on the device address inputs
produce valid data on the device data outputs. The device
remains enabled for read access until the command register
contents are altered.
See “Reading Array Data” for more information. Refer to
the AC Read Operations table for timing specifications and to
the Read Operations Timings diagram for the timing waveforms.
ICC1 in the DC Characteristics table represents the active
current specification for reading array data.
Writing Commands/Command Sequences
To write a command or command sequence (which includes
programming data to the device and erasing sectors of memory),
the system must drive WE\ and CE\ to VIL, and OE\ to VIH.
An erase operation can erase one sector, multiple sectors,
or the entire device. The Sector Address Tables indicate the
address space that each sector occupies. A “sector address”
consists of the address bits required to uniquely select a
sector. See the “Command Definitions” section for details on
erasing a sector or the entire chip, or suspending/resuming the
erase operation.
After the system writes the autoselect command sequence,
the device enters the autoselect mode. The system can then
read autoselect codes from the internal register (which is
separate from the memory array) on DQ7 - DQ0. Standard read
cycle timings apply in this mode. Refer to the “Autoselect
Mode” and “Autoselect Command Sequence” sections for more
information.
ICC2 in the DC Characteristics table represents the active
current specification for the write mode. The “AC
Characteristics” section contains timing specification tables
and timing diagrams for write operations.
Program and Erase Operation Status
During an erase or program operation, the system may
check the status of the operation by reading the status bits on
DQ7 - DQ0. Standard read cycle timings and ICC read
specifications apply. Refer to “Write Operation Status” for
more information, and to each AC Characteristics section for
timing diagrams.
TABLE 1: DEVICE BUS OPERATIONS
OPERATION
CE\
OE\
WE\
Read
L
L
H
Write
L
H
L
CMOS Standby
VCC ± 0.5V
X
X
TTL Standby
H
X
X
Output Disable
L
H
H
A0 - A20
AIN
AIN
X
X
X
DQ0 - DQ7
DOUT
DIN
High-Z
High-Z
High-Z
NOTES: See the “Sector Protection/Unprotection” section for more information.
AS29F040
Rev. 2.2 09/07
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
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