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TDA7267 データシートの表示(PDF) - STMicroelectronics

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TDA7267
ST-Microelectronics
STMicroelectronics ST-Microelectronics
TDA7267 Datasheet PDF : 5 Pages
1 2 3 4 5
APPLICATION CIRCUIT
TDA7267
IN
STAND-BY
VS
0.1µF
IN
SVR
47µF
P-GND
100µF
470µF
OUT
8
D94AU166
VS=12V
APPLICATION HINTS:
For 12V supply and 8speaker application, its
maximum power dissipation is about 1W.
Assumming that max ambient temperature is
70°C. Required thermal resistance of the device
and heat dissipating means must be equal to (150
- 70)/1 = 80°C/W.
Junction to pin thermal resistance of the package
is about 15°C/W. That means external heat sink
of about 65°C/W is required.
Cu ground plane of PCB can be used as heat dis-
sipating means.
Stand-By switches must be able to discharge Csvr
current.
3/5

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