AT24C64C データシートの表示（PDF） - Atmel Corporation

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AT24C64C

2-Wire Serial EEPROM

Atmel Corporation 

AT24C32C/64C

AT24C32C Ordering Information

Ordering Code

Voltage

Package

Operation Range

AT24C32C-PU (Bulk form only)

1.8

AT24C32CN-SH-B(1) (NiPdAu Lead Finish)

1.8

AT24C32CN-SH-T(2) (NiPdAu Lead Finish)

1.8

AT24C32C-TH-B(1) (NiPdAu Lead Finish)

1.8

AT24C32C-TH-T(2) (NiPdAu Lead Finish)

1.8

AT24C32CY6-YH-T(2) (NiPdAu Lead Finish)

1.8

AT24C32CD3-DH-T(2) (NiPdAu Lead Finish)

1.8

AT24C32CU2-UU-T(2)

1.8

8P3

8S1

8S1

8A2

8A2

8Y6

8D3

8U2-1

Lead-free/Halogen-free

Industrial Temperature

(-40°C to 85°C)

AT24C32C-W-11(3)

1.8

Die Sale

Industrial Temperature

(-40°C to 85°C)

Notes: 1. “-B” denotes Bulk.

2. “-T” denotes tape and reel. SOIC = 4K per reel. TSSOP, Ultra Thin Mini-MAP and dBGA2 = 5K per reel.

3. Available in waffle pack, tape and reel, and wafer form; order as SL788 for inkless wafer form. Bumped die available upon

request. Please contact Serial Interface Marketing.

8Y6

8P3

8S1

8A2

8U2-1

8D3

-1.8

Package Type

8-lead, 2.00mm x 3.00mm Body, 0.50mm Pitch, Ultra Thin Mini-MAP, Dual no Lead Package (DFN), (MLP 2x3)

8-lead, 0.300” Wide, Plastic Dual Inline Package (PDIP)

8-lead, 0.150” Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)

8-lead, 4.4 mm Body, Plastic, Thin Shrink Small Outline Package (TSSOP)

8-ball, die Ball Grid Array Package (dBGA2)

8-lead, 1.80 mm x 2.20 mm Body, Ultra Lead Frame Land Grid Array (ULA)

Options

Low Voltage (1.8V to 5.5V)

13

5298A–SEEPR–1/08

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