NX25M041A-5V-R データシートの表示（PDF） - NexFlash -> Winbond Electronics

部品番号

コンポーネント説明

メーカー

NX25M041A-5V-R

NX25Mxxx AND NX26Mxxx SERIES REMOVABLE SERIAL FLASH MODULES

NexFlash -> Winbond Electronics 

NX25Mxxx

NX26Mxxx

NX25Mxxx AND NX26Mxxx SERIES

REMOVABLE SERIAL FLASH MODULES

PRELIMINARY

FEBRUARY 1999

FEATURES

• Serial Flash Module (SFM)

– Removable package for Serial Flash Memories

– 128KB, 256KB, 512KB, 1MB, 2MB, and 4MB-byte

capacities

– Ideal for small portable/mobile products that store

voice, images or data

– Enables unlimited storage, revision updates and

capacity upgrades

• Smallest Removable Flash Card

– Relatively flat 15mm x 45mm (1.8”x 0.6”) form

factor. Less than 15% area of PCMCIA Card

• Ultra-low Power and Fast Programming

– Single 5V or 3V supply for read, Erase/Write

– As low as 5 mA @3V, less than 1 µA standby

– Up to 200KB/sec for Erase/Write

• Simple Interface

– Supports NX25Fxxx SPI (4-pin) or NX26Fxxx NXS

(2-pin) interfaces

– Smart card style self-cleaning connector, only

8-contact pads

– Device Information Sector allows identification of

capacity, voltage and other characteristics

– Optional electronic serial number

• Reduces Overall System Costs

– Smaller case, simple PCB, low-cost connector

– Fewer pins, simple microcontroller

– Reduced power management, lower battery usage

• Development Support

– PC-based Development Kit and Software

DESCRIPTION

The NX25Mxxx and NX26Mxxx Serial Flash Modules

(SFM) provide the benefits of NexFlash’s Serial Flash

Memories in an innovative removable package. SFM sup-

port capacities of 128KB, 256KB, 512KB, 1MB, 2MB, and

4MB. SFM’s are ideal for microcontroller-based

applications, small portable and mobile products, and other

resource-limited systems that store data, voice, and

images. SFM’s have a space-efficient form factor of 15mm

(0.6”) by 45mm (1.8”) that is easy to handle and transport

(see Figure 1). Simple electrical contacts, similar to those

used in smart cards, provide for a reliable and cost-effective

interface to a surface-mount slide-in connector (commonly

used in GSM phones). Up to two Serial Flash Memories can

be mounted onto the module which is made of standard FR4

Epoxy Glass PCB material.

There are two Serial Flash Module package types available:

TSOP and Chip on Board (COB). The leads of the TSOP

package are covered in molded epoxy. The COB version,

which offers a thinner profile, has the chip mounted directly

on the PCB covered in epoxy. Depending on the Serial Flash

device used, modules can be read from and written to at

supply voltages of 5V or 3V. Current consumption is as low

as 5 mA active and 1 µA standby making them highly

suitable for battery operation. The SFM’s can accommo-

date NexFlash’s NX25Fxxx SPI 4-pin interface or NX26Fxxx

NXS 2-pin interface Serial Flash memory devices. DOS

compatible sectors allow for sustained

Erase/Write rates of over 200K bytes/sec. Other features of

the Serial Flash Module include on-chip SRAM, electronic

ID, flexible write protection and insertion/removal detection.

(Note: This document is supplementary to the NX25Fxxx

and NX26Fxxx Serial Flash Memory data sheets.)

45mm

(1.80)

1MB SPI-5V

N X 2 5 M 0 8 0 A - 5 T- R

Serial

Flash

Module

15mm

(0.60)

Note: Inches are in parentheses

NXD010A-1298

Figure 1. Serial Flash Module

This document contains PRELIMINARY INFORMATION. NexFlash reserves the right to make changes to its product at any time without notice in order to improve design and supply the best

possible product. We assume no responsibility for any errors which may appear in this publication.  Copyright 1998, NexFlash Technologies, Inc.

NexFlash Technologies, Inc.

1

PRELIMINARY NXSF012B-0599

02/22/00 ©

Share Link: