NX26M011A-5V-R データシートの表示（PDF） - NexFlash -> Winbond Electronics

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NX26M011A-5V-R

NX25Mxxx AND NX26Mxxx SERIES REMOVABLE SERIAL FLASH MODULES

NexFlash -> Winbond Electronics 

NX25Mxxx

NX26Mxxx

Vcc

CS1*

C1

C2 (11)

CS0

SCK

SO

SI

WP/DT

Detect Control*

C4 (11)

C3 (2)

C7 (3)

C8 (13)

C6 (12)

10K

WPS

MICROCONTROLLER

(DSP or ASIC)

* OPTIONAL

C5

CS0

SCK

CS1

Vcc

(4) (1)

CS1 R/B Hold*

#1

CS0

SCK

SO

SI

WP/DT

Vcc

#0

Serial Flash

Memory

SPI Interface

25Fxxx Series

GND

R/B

Hold

(14)

(1)

Vcc

CS1

SCK

CSO

SI

SO

WP/DT

GND

CSO

SCK

CS1

Vcc

C1

C5 GND

C2 DT C6 WP/DT

C3

C7 SO BOTTOM VIEW

C4

C8 SI

(CONTACT SIDE)

C4

C3

C2 DT

C1

C8 SI

C7 SO

C6 WP/DT

C5 GND

TOP VIEW

(LABEL SIDE)

NXD011A-0598

Figure 2. Typical interface for Serial Flash Module with SPI Interface using NX25Fxxx Series Devices.

Equivalent pin numbers for TSOP (Type II) are listed in parentheses. SPI contact assignments are shown for Bottom

and Top Views of Serial Flash Module and Top View of the ITT Cannon Slide-insertion Connector (Model CCM-03-3504).

PIN DESCRIPTIONS

SPI NX25Fxxx Series

Note: See NX25Fxxx Data Sheets for further information

Power Supply Pins (Vcc and Gnd)

Supply source for 5V or 3V. Contact layout allows for the

module to be inserted and removed while power is applied

(“hot-socketing”) without damaging the module’s memory

device.

Serial Data Input (SI)

The SPI bus Serial Data Input (SI) provides a means for

commands or data to be written to (shifted into) the device.

Serial Data Output (SO)

The SPI bus Serial Data Output (SO) provides a means for

data to be read from (shifted out of) the device. When the

device is deselected (CS=1) SO pin is in a high-impedance

state.

Serial Clock (SCK)

All commands and data written to the Serial Input (SI) are

clocked relative to the rising edge of Serial Clock (SCK). All

data read from the Serial Data Output (SO) is clocked

relative to the falling edge of SCK.

Chip Selects (CS0 and CS1)

CS0 selects device location 0, which is on the contact side

of the module. CS1 selects device location 1, which is

located on the opposite side of module from device #0. CS1

is only used when a module has two serial flash memories.

Chip select inputs are asserted low.

Write Protect/Detect (WP/DT)

The Write Protect/Detect pin is an optional dual function pin.

Write Protect (WP)

Used as a Write Protect Input (WP), when WP is asserted

(active low) the entire flash memory array is Write Pro-

tected. WP can be controlled by the interface or as an

optionally available contact pad directly on the module.

Detect (DT)

Using a pull-up resistor, a card detect (DT) can provide a

low to high or high to low transition when the module is

inserted or removed. The pulse is best used in conjunction

with an interrupt input of a microcontroller or processor.

R/B Hold

The Ready/Busy-Hold pin function is not available for use

with the SFM. This pin must be set to “No Connect” in the

NX25Fxxx configuration register.

2

NexFlash Technologies, Inc.

PRELIMINARY NXSF012B-0599

02/22/00 ©

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