NX25M041A-3V-R データシートの表示（PDF） - NexFlash -> Winbond Electronics

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NX25M041A-3V-R

NX25Mxxx AND NX26Mxxx SERIES REMOVABLE SERIAL FLASH MODULES

NexFlash -> Winbond Electronics 

NX25Mxxx

NX26Mxxx

Vcc

C1

(4) (1)

A3-1*

C2 (11)

A3

A0

#1

1

Vcc

#0

SERIAL I/O,

AND GENERAL

A3-0

C4 (11)

A3

PURPOSE

PORT PINS

SCK

SIO

A1

C3 (2)

C7 (3)

C8 (13)

SCK

SIO

A1

Serial Flash

Memory

NXS Interface

2

A2, WP/DT

C6 (12)

A2

26Fxxx Series

Vcc C1

C5 GND

Detect Control* 10K

WPS

A3-1

C2 DT C6 A2 & WP/DT

MICROCONTROLLER

C5

GND

A0

SCK C3

A3-0 C4

C7 SIO

C8 A1

BOTTOM VIEW

(CONTACT SIDE)

3

(14)

(1)

(DSP or ASIC)

* OPTIONAL

A3-0

SCK

A3-1

Vcc

A1

A3-0

C4

C8 A1

TOP VIEW

SIO

SCK C3

C7 SIO

(LABEL SIDE)

4

A2 & WP/DT A3-1

C2 DT C6 A2 & WP/DT

GND

Vcc

C1

C5 GND

NXD012A-0598

5

Figure 3. Typical interface for Serial Flash Module with NXS Interface using NX26Fxxx Series Devices.

6 Equivalent pin numbers for TSOP (Type II) are listed in parentheses. NXS contact assignments are shown for Bottom

and Top Views of Serial Flash Module and Top View of the ITT Cannon Slide-insertion Connector (Model CCM-03-3504).

PIN DESCRIPTIONS

NXS NX26Fxxx Series

Note: See NX26Fxxx Data Sheets for further information

Power Supply Pins (Vcc and Gnd)

Supply source for 5 or 3.0V. Contact layout allows for the

module to be inserted and removed while power is applied

(“hot-socketing”) without damaging the module’s memory

device.

Serial Data Input/Output (SIO)

The NXS bus Serial Data Input/Output (SIO) provides a

means for commands or data to be written to (shifted into)

the device or read from (shifted out of) the device. When the

device is deselected SIO pin is in a high-impedance state.

Serial Clock (SCK)

All commands and data written to the Serial Input (SI) are

clocked relative to the rising edge of Serial Clock (SCK). All

data read from the Serial Data Output (SO) is clocked

relative to the falling edge of SCK.

Device Address Pins (A0, A1, A2, A3)

There is no separate chip select signal for the NXS inter-

face (NX26Fxxx series), instead four static address signals

(A0, A1, A2, and A3) are provided for decoding one of 16

possible addresses. The A0 address signal, which is not

7

available on the contact pad, is tied low for device #0 (on the

contact side) and is tied high for device #1 (optionally used on

the top side). A1, A2, A3-0, and A3-1, which are available on

8 the contact pad, must be tied high or low at the connector

according to the desired address of device #0 or #1.

Write Protect/Detect (WP/DT)

9 The Write Protect/Detect pin is an optional dual function pin.

Write Protect (WP)

Write Protect Input (WP) can be used as a status indicator

10 for the firmware to determine if a write protect condition

exists on the SFM (if optional WP switch or contact pad is

available on the SFM). Unlike the NX25Fxxx SPI series the

low on WP does not provide a direct electrical protection of

the device. Note that this pin also serves as the A2 address.

11 If used for write protect status the change in device address

must be taken into consideration.

Detect (DT)

12 Using a pull-up resistor, a card detect (DT) can provide a

low-to-high or high-to-low transition when the module is

inserted or removed. The pulse is best used in conjunction

with an interrupt input of a microcontroller or processor. Note

that this pin also serves as the A2 address. If used for detect

status the device address must be taken into consideration.

NexFlash Technologies, Inc.

3

PRELIMINARY NXSF012B-0599

02/22/00 ©

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