AT24C01A-W2.7-11 データシートの表示（PDF） - Atmel Corporation

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AT24C01A-W2.7-11

Two-wire Serial EEPROM 1K (128 x 8) 2K (256 x 8) 4K (512 x 8) 8K (1024 x 8) 16K (2048 x 8)

Atmel Corporation 

AT24C02 Ordering Information(1)

Ordering Code

Package

Operation Range

AT24C02-10PI-2.7

8P3

Industrial Temperature

AT24C02N-10SI-2.7

8S1

AT24C02-10TI-2.7

8A2

(–40°C to 85°C)

AT24C02-10PI-1.8

8P3

Industrial Temperature

AT24C02N-10SI-1.8

8S1

AT24C02-10TI-1.8

8A2

(–40°C to 85°C)

AT24C02-10PU-2.7(2)

AT24C02-10PU-1.8(2)

AT24C02N-10SU-2.7(2)

AT24C02N-10SU-1.8(2)

AT24C02-10TU-2.7(2)

AT24C02-10TU-1.8(2)

AT24C02Y1-10YU-1.8(2)

AT24C02-10TSU-1.8(2)

AT24C02U3-10UU-1.8(2)

AT24C02-W2.7-11(3)

AT24C02-W1.8-11(3)

8P3

8P3

8S1

8S1

8A2

8A2

8Y1

5TS1

8U3-1

Die Sale

Die Sale

Lead-free/Halogen-free/

Industrial Temperature

(–40°C to 85°C)

Industrial Temperature

(–40°C to 85°C)

Notes:

1. For 2.7V devices used in the 4.5V to 5.5V range, please refer to performance values in the AC and DC characteristics table.

2. “U” designates Green Package + RoHS compliant.

3. Available in waffle pack and wafer form; order as SL719 for wafer form. Bumped die available upon request. Please contact

Serial EEPROM Marketing.

8P3

8S1

8A2

8Y1

5TS1

8U3-1

–2.7

–1.8

Package Type

8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)

8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)

8-lead, 4.4 mm Body, Plastic Thin Shrink Small Outline Package (TSSOP)

8-lead, 4.90 mm x 3.00 mm Body, Dual Footprint, Non-leaded, Miniature Array Package (MAP)

5-lead, 2.90 mm x 1.60 mm Body, Plastic Thin Shrink Small Outline Package (SOT23)

8-ball, die Ball Grid Away Package (dBGA2)

Options

Low-voltage (2.7V to 5.5V)

Low-voltage (1.8V to 5.5V)

14 AT24C01A/02/04/08A/16A

0180V–SEEPR–8/05

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