AT24C01A-W2.7-11 データシートの表示（PDF） - Atmel Corporation

部品番号

コンポーネント説明

メーカー

AT24C01A-W2.7-11

Two-wire Serial EEPROM 1K (128 x 8) 2K (256 x 8) 4K (512 x 8) 8K (1024 x 8) 16K (2048 x 8)

Atmel Corporation 

AT24C01A/02/04/08A/16A

AT24C16A Ordering Information(1)

Ordering Code

Package

Operation Range

AT24C16A-10PI-2.7

AT24C16AN-10SI-2.7

AT24C16A-10TI-2.7

8P3

Industrial Temperature

8S1

(–40°C to 85°C)

8A2

AT24C16A-10PI-1.8

AT24C16AN-10SI-1.8

AT24C16A-10TI-1.8

8P3

Industrial Temperature

8S1

(–40°C to 85°C)

8A2

AT24C16A-10PU-2.7(2)

AT24C16A-10PU-1.8(2)

AT24C16AN-10SU-2.7(2)

AT24C16AN-10SU-1.8(2)

AT24C16A-10TU-2.7(2)

AT24C16A-10TU-1.8(2)

AT24C16AY1-10YU-1.8(2)

AT24C16AY5-10YU-1.8(2)

AT24C16AU2-10UU-1.8(2)

AT24C16A-W2.7-11(3)

AT24C16A-W1.8-11(3)

8P3

8P3

8S1

8S1

8A2

8A2

8Y1

8Y5

8U2-1

Die Sale

Die Sale

Lead-free/Halogen-free/

Industrial Temperature

(−40°C to 85°C)

Industrial Temperature

(−40°C to 85°C)

Notes:

1. For 2.7V devices used in the 4.5V to 5.5V range, please refer to performance values in the AC and DC characteristics table.

2. “U” designates Green Package + RoHS compliant.

3. Available in waffle pack and wafer form; order as SL719 for wafer form. Bumped die available upon request. Please contact

Serial EEPROM Marketing.

8P3

8S1

8A2

8Y1

8Y5

8U2-1

−2.7

−1.8

Package Type

8-pin, 0.300" Wide, Plastic Dual Inline Package (PDIP)

8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)

8-lead, 0.170" Wide, Thin Shrink Small Outline Package (TSSOP)

8-lead, 4.90 mm x 3.00 mm Body, Dual Footprint, Non-leaded, Miniature Array Package (MAP)

8-lead, 2.00 mm x 3.00 mm Body, Dual Footprint, Non-leaded, Miniature Array Package (MAP)

8-ball, die Ball Grid Array Package (dBGA2)

Options

Low Voltage (2.7V to 5.5V)

Low Voltage (1.8V to 5.5V)

17

0180V–SEEPR–8/05

Share Link: