NX25F641C-3T データシートの表示（PDF） - NexFlash -> Winbond Electronics
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NX25F641C-3T Datasheet PDF : 23 Pages
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NX25F641C
ABSOLUTE MAXIMUM RATINGS (1)
Symbol
Vcc
VIN, VOUT
TSTG
TLEAD
Parameters
Supply Voltage
Voltage Applied to Any Pin
Storage Temperature
Lead Temperature
Conditions
Range
Unit
0 to +4.0
V
Relative to Ground
–0.5 to Vcc + 0.5
V
–65 to +150
°C
Soldering 10 Seconds
+300
°C
Note:
1. This device has been designed and tested for the specified operation ranges. Proper operation outside of these levels is not
guaranteed. Exposure beyond absolute maximum ratings (listed above) may cause permanent damage.
OPERATING RANGES
Symbol
Vcc
TA
Parameter
Supply Voltage
Ambient Temperature, Operating
Conditions
3.0V
Commercial
Industrial
Min
Max
Unit
2.7
3.6
V
0
70
°C
–40
+85
°C
DC ELECTRICAL CHARACTERISTICS (Preliminary)
Symbol
VI L
VI H
VO L
VO H
VO LC
VO HC
IIL
IOL
ICC
(active)
ICC
(active)
ICCSB
(standby)
CIN
COUT
Parameter
Conditions
Input Low Voltage
Input High Voltage
Output Low Voltage
IOL = 2 mA, VCC = 2.7V
Output High Voltage
IOH = –100 µA, VCC = 2.7V
Output Low Voltage CMOS VCC = 2.7V, IOL = 10 µA
Output High Voltage CMOS VCC = 2.7V, IOH = –10 µA
Input Leakage
0 < VIN < Vcc
I/O Leakage
0 < VIN < Vcc
Active Power Supply Current SCK @ 8 MHz, VCC = 3V
Erase/Write
Active Power Supply Current SCK @ 8 MHz, VCC = 3V
Read
Standby Vcc Supply Current CS = VCC, VIN = Vcc or 0
Standby
Input Capacitance (1)
TA = 25°C, VCC = 3V
Frequency = 1 MHz
Output Capacitance (1)
TA = 25°C, VCC = 3V
Frequency = 1 MHz
Note:
1. Tested on a sample basis or specified through design or characterization data.
Min
Typ
–0.4
—
Vcc –0.7 —
—
—
Vcc –0.85 —
—
—
VCC –0.3 —
–10
—
–10
—
—
2.5
Max
Unit
Vcc 0.2 V
Vcc +0.3 V
0.45
V
—
V
0.15
V
—
V
+10
µA
+10
µA
5
mA
—
5
10
mA
—
<1
10
µA
—
—
10
pF
—
—
10
pF
NexFlash Technologies, Inc.
19
PRELIMINARY NXSF032A-0502
05/06/02 ©
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