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ATA6613 データシートの表示(PDF) - Atmel Corporation

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ATA6613 Datasheet PDF : 364 Pages
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Table 2-2. Maximum Ratings of the SiP
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating
only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this
specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Parameters
Symbol
Min.
Typ.
Max.
Unit
HBM ESD
ANSI/ESD-STM5.1
JESD22-A114
AEC-Q100 (002)
±2
KV
CDM ESD STM 5.3.1
±750
V
Storage temperature
Operating temperature(1)
Thermal resistance junction to heat slug
Thermal resistance junctiion to ambient
Thermal shutdown of VCC regulator
Ts
Tcase
Rthjc
Rthja
–55
+150
°C
–40
+125
°C
6
K/W
30
K/W
150
165
170
°C
Thermal shutdown of LIN output
150
165
170
°C
Thermal shutdown hysteresis
10
°C
Note: 1. Tcase means the temperature of the heat slug (backside). It is mandatory that this backside temperature is 125°C in the
application.
4 ATA6612/ATA6613
9111G–AUTO–05/10

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