BA6406 データシートの表示（PDF） - ROHM Semiconductor

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BA6406

2-Phase Half-Wave Pre Driver for Fan Motor

ROHM Semiconductor 

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〇CAUTIONS ON USE

1) Absolute maximum ratings

An excess in the absolute maximum rations, such as supply voltage, temperature range of operating conditions, etc., can break

down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If any over rated

values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as fuses.

2) Connecting the power supply connector backward

Connecting of the power supply in reverse polarity can damage IC. Take precautions when connecting the power supply lines. An

external direction diode can be added.

3) Power supply line

Back electromotive force causes regenerated current to power supply line, therefore take a measure such as placing a capacitor

between power supply and GND for routing regenerated current. And fully ensure that the capacitor characteristics have no problem

before determine a capacitor value. (when applying electrolytic capacitors, capacitance characteristic values are reduced at low

temperatures)

4) GND potential

The potential of GND pin must be minimum potential in all operating conditions. Also ensure that all terminals except GND terminal

do not fall below GND voltage including transient characteristics. However, it is possible that the motor output terminal may deflect

below GND because of influence by back electromotive force of motor. Malfunction may possibly occur depending on use condition,

environment, and property of individual motor. Please make fully confirmation that no problem is found on operation of IC.

5) Thermal design

Use a thermal design that allows for a sufficient margin in light of the power dissipation(Pd) in actual operating conditions.

6) Inter-pin shorts and mounting errors

Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any connection error

or if pins are shorted together.

7) Actions in strong electromagnetic field

Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to malfunction.

8) ASO

When using the IC, set the output transistor so that it does not exceed absolute maximum rations or ASO.

9) Testing on application boards

When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress. Always

discharge capacitors after each process or step. Always turn the IC’s power supply off before connecting it to or removing it from a

jig or fixture during the inspection process. Ground the IC during assembly steps as an antistatic measure. Use similar precaution

when transporting or storing the IC.

10) GND wiring pattern

When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns, placing a

single ground point at the ground potential of application so that the pattern wiring resistance and voltage variations caused by large

currents do not cause variations in the small signal ground voltage. Be careful not to change the GND wiring pattern of any external

components, either.

11) Capacitor between output and GND

When a large capacitor is connected between output and GND, if Vcc is shorted with 0V or GND for some cause, it is possible that

the current charged in the capacitor may flow into the output resulting in destruction. Keep the capacitor between output and GND

below 100uF.

12) IC terminal input

When Vcc voltage is not applied to IC, do not apply voltage to each input terminal. When voltage above Vcc or below GND is

applied to the input terminal, parasitic element is actuated due to the structure of IC. Operation of parasitic element causes mutual

interference between circuits, resulting in malfunction as well as destruction in the last. Do not use in a manner where parasitic

element is actuated.

REV. G

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