NXP Semiconductors
9. Package outline
Plastic surface-mounted package; 5 leads
D
B
BAP64Q
Quad PIN diode attenuator
SOT753
E
A
X
y
5
4
1
2
3
e
bp
wM B
HE
vM A
A
A1
Q
c
Lp
detail X
0
1
scale
2 mm
DIMENSIONS (mm are the original dimensions)
UNIT A
A1 bp
c
D
E
e
HE Lp
Q
v
w
y
mm
1.1 0.100 0.40 0.26
0.9 0.013 0.25 0.10
3.1
2.7
1.7
1.3
0.95
3.0
2.5
0.6
0.2
0.33
0.23
0.2
0.2
0.1
OUTLINE
VERSION
IEC
SOT753
Fig 12. Package outline SOT753
BAP64Q
Product data sheet
REFERENCES
JEDEC
JEITA
SC-74A
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 7 October 2010
EUROPEAN
PROJECTION
ISSUE DATE
02-04-16
06-03-16
© NXP B.V. 2010. All rights reserved.
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