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BBY58-05W(2007) データシートの表示(PDF) - Infineon Technologies

部品番号
コンポーネント説明
メーカー
BBY58-05W
(Rev.:2007)
Infineon
Infineon Technologies Infineon
BBY58-05W Datasheet PDF : 10 Pages
1 2 3 4 5 6 7 8 9 10
Package TSLP-2-1
Package Outline
Top view
0.4 +0.1
0.05 MAX.
Bottom view
0.6 ±0.05
2
1
Cathode
marking
2
1
0.5 ±0.0351)
1) Dimension applies to plated terminal
Foot Print
For board assembly information please refer to Infineon website "Packages"
0.6
0.45
BBY58...
Copper Solder mask
Marking Layout (Example)
Stencil apertures
BAS16-02L
Type code
Cathode marking
Laser marking
Standard Packing
Reel ø180 mm = 15.000 Pieces/Reel
Reel ø330 mm = 50.000 Pieces/Reel (optional)
4
0.5
Cathode
marking
0.76
9
2007-09-19

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