BD9528MUV データシートの表示（PDF） - ROHM Semiconductor
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BD9528MUV Datasheet PDF : 34 Pages
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BD9528MUV
Technical Note
●Absolute maximum ratings (Ta=25℃)
Parameter
Terminal Voltage
Power Dissipation1
Power Dissipation2
Power Dissipation3
Power Dissipation4
Operating temperature Range
Storage temperature Range
Junction Temperature
Symbol
VIN, CTL,SW1,SW2
EN1, EN2, PGOOD1, PGOOD2
Vo1, Vo2, MCTL1, MCTL2
FS1, FS2, FB1, FB2, ILIM1, ILIM2,
SS1, SS2, LG1, LG2, REF,REG2
BOOT1, BOOT2
BOOT1-SW1, BOOT2-SW2,
HG1-SW1, HG2-SW2
HG1
HG2
PGND1, PGND2
Pd1
Pd2
Pd3
Pd4
Topr
Tstg
Tjmax
Limits
30 *1*2
6 *1*2
Unit
V
V
REG1+0.3 *1
V
35 *1*2
V
7 *1*2
V
BOOT1+0.3 *1*2
V
BOOT2+0.3 *1*2
V
AGND±0.3 *1*2
V
0.38 *3
W
0.88 *4
W
3.26 *5
W
4.56 *6
W
-20～+100
℃
-55～+150
℃
+150
℃
*1 Do not however exceed Pd.
*2 Instantaneous surge voltage, back electromotive force and voltage under less than 10% duty cycle.
*3 Reduced by 3.0mW for each increase in Ta of 1℃ over 25℃ (when don’t mounted on a heat radiation board )
*4 Reduced by 7.0mW for increase in Ta of 1℃ over 25℃. (when mounted on a board 74.2mm×74.2mm×1.6mm Glass-epoxy PCB which has 1 layer.
(Copper foil area : 20.2mm2)
*5 Reduced by 26.1mW for increase in Ta of 1℃ over 25℃. (when mounted on a board 74.2mm×74.2mm×1.6mm Glass-epoxy PCB which has 4 layers.
(1st and 4th copper foil area : 20.2mm2, 2nd and 3rd copper foil area : 5505mm2)
*6 Reduced by 36.5mW for increase in Ta of 1℃ over 25℃. (when mounted on a board 74.2mm×74.2mm×1.6mm Glass-epoxy PCB which has 4 layers.
(All copper foil area : 5505mm2)
●Operating conditions(Ta=25℃)
Parameter
Terminal Voltage
MIN ON TIME
Symbol
VIN
CTL
EN1, EN2, MCTL1, MCTL2
BOOT1, BOOT2
SW1, SW2
BOOT1-SW1, BOOT2-SW2, HG1-SW1, HG2-SW2
Vo1, Vo2, PGOOD1, PGOOD2
TONmin
★ This product should not be used in a radioactive environment.
MIN.
5.5
-0.3
-0.3
4.5
-0.3
-0.3
-0.3
-
MAX.
28
28
5.5
33
28
5.5
5.5
150
Unit
V
V
V
V
V
V
V
nsec
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2010.03 - Rev.A
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