BGA430 データシートの表示（PDF） - Infineon Technologies
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BGA430 Datasheet PDF : 9 Pages
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BGA430
Preliminary
Maximum Ratings
Note: All voltages refer to GND-Node
Parameter
Symbol
Value
Unit
Device voltage
Device current
Current into pin In
Input power1)
Total power dissipation, TS < 80˚C2)
Junction temperature
Ambient temperature range
Storage temperature range
VCC
ID
IB
PIN
Ptot
Tj
TA
TSTG
Thermal resistance: junction-soldering point Rth JS
1) Valid for ZS=ZL=50Ω, VCC=5V or VCC=0V
2) TS is measured on the emitter lead at the soldering point to the PCB
6.5
35
1
10
228
150
-65 ... +150
-65 ... +150
300
V
mA
mA
dBm
mW
˚C
˚C
˚C
K/W
Electrical Characteristics at TA=25˚C (measured on application PCB in fig. 2) 1)
VCC=5V, unless otherwise specified
Parameter
Symbol min. typ. max. Unit
Insertion power gain
f=0.9GHz
|S21|2
32
dB
f=2.15GHz
28
Noise figure (ZS=50Ω)
f=0.9GHz
NF
f=2.15GHz
2.2
dB
2.4
Output power at 1dB gain compression
ZL=50Ω
f=0.9GHz
f=2.15GHz
P-1dB
dBm
2
3
Output third order intercept point
ZS/L=50Ω
f=0.9GHz
f=2.15GHz
OIP3
dBm
12
13
Input return loss
f=0.9GHz
RLIn
20
f=2.15GHz
12
Output return loss
f=0.9GHz
RLOut
9
f=2.15GHz
15
Device current
ID
23
mA
1) Note: all measurement results are not compensated for PCB losses: 0.05 dB at 0.9 GHz, 0.2 dB at 2.15 GHz
and 0.3 dB at 6 GHz at RFin / RFout
Preliminary data sheet
5
2002-05-03
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