BGX7100 データシートの表示（PDF） - NXP Semiconductors.

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BGX7100

Transmitter IQ modulator

NXP Semiconductors. 

NXP Semiconductors

BGX7100

Transmitter IQ modulator

5. Ordering information

Table 1. Ordering information

Type number

Package

Name

Description

BGX7100HN

HVQFN24 plastic thermal enhanced very thin quad flat package; no leads; 24

terminals; body 4  4  0.85 mm

6. Functional diagram

Version

SOT616-3

I MODULATION IN

LOCAL OSCILLATOR IN

Q MODULATION IN

BGX7100

0°

90°

RF OUT

001aao016

Fig 1. Functional block diagram

Differential I and Q baseband inputs are each fed to an associated upconverter mixer. The

Local Oscillator (LO) carrier input is buffered and split into 0 degree and 90 degree

signals. The in-phase signal is passed to the I mixer and the 90 degree phase-changed

signal is passed to the Q mixer. The outputs of the mixers are summed to produce the

resulting RF output signal.

7. Pinning information

7.1 Pinning

The BGX7100 device pinout is designed to allow easy interfacing when mounted on a

Printed-Circuit Board (PCB). When viewing the device from above, the two differential IQ

baseband input paths are at the top and bottom. The common LO input is at the left and

the RF output at the right. Multiple power and ground pins allow for independent supply

domains, improving isolation between blocks. A small package footprint is chosen to

reduce bond-wire induced series inductance in the RF ports.

The input and output pin matching is described in Section 12 “Application information”.

BGX7100

Product data sheet

All information provided in this document is subject to legal disclaimers.

Rev. 5 — 3 September 2012

© NXP B.V. 2012. All rights reserved.

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