BSP603S2L(2000) データシートの表示（PDF） - Infineon Technologies
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BSP603S2L Datasheet PDF : 5 Pages
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Thermal Characteristics
Parameter
Target data sheet
Symbol
Characteristics
Thermal resistance, junction - soldering point
(Pin 3)
SMD version, device on PCB:
@ min. footprint
@ 6 cm2 cooling area F)
RthJS
RthJA
BSP603S2L
Values
Unit
min. typ. max.
-
17 tbd K/W
-
100 tbd
-
-
70
Electrical Characteristics, at Tj = 25 °C, unless otherwise specified
Parameter
Symbol
Values
Unit
min. typ. max.
Static Characteristics
Drain-source breakdown voltage
VGS = 0 V, ID = 1 mA
Gate threshold voltage, VGS = VDS
ID = 50 µA
Zero gate voltage drain current
VDS = 55 V, VGS = 0 V, Tj = 25 °C
VDS = 55 V, VGS = 0 V, Tj = 125 °C
V(BR)DSS 55
-
-V
VGS(th)
1.2
1.6
2
IDSS
µA
-
0.1
1
-
10 100
Gate-source leakage current
VGS = 20 V, VDS = 0 V
Drain-source on-state resistance
VGS = 4.5 V, ID = 2.6 A
Drain-source on-state resistance
VGS = 10 V, ID = 2.6 A
IGSS
-
10 100 nA
RDS(on)
-
tbd 40 mΩ
RDS(on)
-
tbd 33
Page 2
2000-04-28
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