NXP Semiconductors
BT1308 series D
Triacs logic level
5. Thermal characteristics
Table 4. Thermal characteristics
Symbol Parameter
Conditions
Min Typ Max Unit
Rth(j-lead) thermal resistance from junction to lead full cycle
-
Rth(j-a)
thermal resistance from junction to
ambient
full cycle; printed-circuit board -
mounted; lead length 4 mm;
see Figure 6
-
60
K/W
150 -
K/W
102
Zth(j-lead)
(K/W)
10
003aac206
1
P
10−1
10−2
10−5
10−4
10−3
10−2
10−1
tp
t
1
tp (s)
10
Fig 6. Transient thermal impedance from junction to solder point as a function of pulse width
BT1308_SER_D_1
Product data sheet
Rev. 01 — 26 February 2008
© NXP B.V. 2008. All rights reserved.
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