BYG85B データシートの表示（PDF） - Philips Electronics
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BYG85B Datasheet PDF : 12 Pages
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Philips Semiconductors
Fast soft-recovery rectifier
Product specification
BYG85B
FEATURES
• Glass passivated
• High maximum operating
temperature
• Low leakage current
• Excellent stability
• UL 94V-O classified plastic
package
• Shipped in 12 mm embossed tape.
DESCRIPTION
DO-214AC surface mountable
package with glass passivated chip.
handbook, 4 columns
cathode
band
k
a
The well-defined void-free case is of a
transfer-moulded thermo-setting
plastic.
Top view
Side view
MSA474
Fig.1 Simplified outline (DO-214AC; SOD106) and symbol.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
CONDITIONS
VRRM
VR
IF(AV)
IF(AV)
IF(AV)
IFRM
IFRM
IFRM
IFSM
Tstg
Tj
repetitive peak reverse voltage
continuous reverse voltage
average forward current
Ttp = 100 °C; averaged over any
20 ms period; see Figs 2 and 7
average forward current
Tamb = 60 °C; AL2O3 PCB mounting
(see Fig.11); averaged over any
20 ms period; see Fig.3
average forward current
Tamb = 60 °C; epoxy PCB mounting
(see Fig.11); averaged over any
20 ms period; see Fig.3
repetitive peak forward current
repetitive peak forward current
Ttp = 100 °C; see Fig.3
Tamb = 60 °C; AL2O3 PCB mounting;
see Fig.5
repetitive peak forward current
Tamb = 60 °C; epoxy PCB mounting;
see Fig.6
non-repetitive peak forward current t = 10 ms half sine wave; Tj = Tj max
prior to surge; VR = VRRMmax
storage temperature
junction temperature
MIN.
−
−
−
−
−
−
−
−
−
−65
−65
MAX.
100
100
2.5
UNIT
V
V
A
1.3 A
0.98 A
23 A
12 A
8.5 A
35 A
+175 °C
+175 °C
1998 Nov 25
2
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