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L235(2008) データシートの表示(PDF) - STMicroelectronics

部品番号
コンポーネント説明
メーカー
L235
(Rev.:2008)
ST-Microelectronics
STMicroelectronics ST-Microelectronics
L235 Datasheet PDF : 11 Pages
1 2 3 4 5 6 7 8 9 10
Package information
3
Package information
TS432
In order to meet environmental requirements, STMicroelectronics offers these devices in
ECOPACK® packages. These packages have a lead-free second level interconnect. The
category of second level interconnect is marked on the package and on the inner box label,
in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an STMicroelectronics
trademark. ECOPACK specifications are available at: www.st.com.
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